FX6-100S-0.8SV Hirose Electric Co Ltd, FX6-100S-0.8SV Datasheet - Page 13

CONN RECEPT 100POS .8MM W/BOSS

FX6-100S-0.8SV

Manufacturer Part Number
FX6-100S-0.8SV
Description
CONN RECEPT 100POS .8MM W/BOSS
Manufacturer
Hirose Electric Co Ltd
Series
FX6r
Datasheet

Specifications of FX6-100S-0.8SV

Connector Type
Receptacle, Center Strip Contacts
Number Of Positions
100
Pitch
0.031" (0.80mm)
Number Of Rows
2
Mounting Type
Surface Mount
Contact Finish
Gold
Mated Stacking Heights
5mm, 6mm, 7mm
Height Above Board
0.157" (4.00mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Contact Finish Thickness
-
Other names
*FX6-100S-0.8SV
H2431

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FX6-100S-0.8SV
Manufacturer:
Hirose Electric Co Ltd
Quantity:
12 000
Part Number:
FX6-100S-0.8SV(23)
Manufacturer:
MOLEX
Quantity:
430
Part Number:
FX6-100S-0.8SV(71)
Manufacturer:
CITIZEN
Quantity:
1 704
Part Number:
FX6-100S-0.8SV(71)
Manufacturer:
Hirose Electric Co Ltd
Quantity:
250
Part Number:
FX6-100S-0.8SV(71)?
Manufacturer:
XILINX
Quantity:
2 340
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
BPrecautions
1. Tolerance Clearance on Mating Side
2. Mounting Temperature Profile (Reference)
3. Board to Board Size
The effective contact length of the product is set to 1.7mm. Please use the products as to set the clearance within 1.0mm
between the header and the receptacle in the mating process.
The board to board size of the male/female connector shown in the application pattern doesn't include the solder paste
thickness. Thus, after the connector is mounted on the board, consider that the board to board size will be widened in
proportion to the solder paste thickness.
(ç)
260
240
220
200
180
160
140
0
150ç
Pre-heating time
(150 to 200ç)
90 to 120s
Time (Second)
200ç
Soldering Time
(220ç min.)
(MAX250ç)
MAX 60s
220ç
HRS test conditions
Test boardGlass epoxy 110mm∞55mm∞1.6mm thick
Solder method
Solder composition
Metal mask
Reflow cycles
The temperature profile is based on the above
conditions.
In individual applications the actual temperature may
vary, depending on solder paste type,
volume/thickness and board size/thickness. Consult
your solder paste and equipment manufacturer for
specific recommendations.
FX6 Series●0.8mm Pitch Stacking Height 5 to 9mm Connector
:Reflow
:Paste,
: 0.15mm thick
: 2 cycles
96.5%Sn/3%Ag/0.5%Cu
A155

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