2QSP24-TJ1-330 Bourns Inc., 2QSP24-TJ1-330 Datasheet - Page 2

• Manufacturer Part Number: 2QSP24-TJ1-330
• Description: RESNET 33 OHM 24PIN ISOLATE QSOP
• Manufacturer: Bourns Inc.
• Series: 2QSPr

Specifications of 2QSP24-TJ1-330

• Resistance (ohms): 33
• Number Of Resistors: 12
• Circuit Type: Isolated
• Temperature Coefficient: ±100ppm/°C
• Tolerance: ±5%
• Power Per Element: 100mW
• Number Of Pins: 24
• Package / Case: 24-LSSOP (0.154", 3.91mm Width)
• Size / Dimension: 0.344" L x 0.157" W (8.74mm x 3.99mm)
• Height: 0.069" (1.75mm)
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 125°C
• Other names: 2QSP24-TJ1-330M

Mechanical Characteristics
QSOP Package Dimensions
Thin Film on Silicon 2QSP / 2NBS -XX1 Isolated Resistors
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MO-137.
(.150 - .157)
3.81 - 3.99
2QSP16
2QSP20
2QSP24
2QSP28
Model
PIN 1
0-8 °
(.053 - .069)
1.35 - 1.75
(.004 - .010)
.10 - .25
(.228 - .244)
5.80 - 6.20
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
(.025)
.635
A
(.008 - .012)
TYP.
.21 - .31
A
(.007 - .010)
(.016 - .050)
.41 - 1.27
.19 - .25
Narrow-Body SOIC Package Dimensions
Customers should verify actual device performance in their specific applications.
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MS-012.
(.150 - .157)
3.81 - 3.99
2NBS08
2NBS14
2NBS16
Model
PIN 1
0-8 °
(.053 - .069)
1.35 - 1.75
(.004 - .010)
.10 - .25
(.228 - .244)
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
Specifications are subject to change without notice.
5.80 - 6.20
(.050)
(.014 - .018)
1.27
0.36 - 0.46
A
TYP.
A
(.007 - .010)
(.016 - .050)
.41 - 1.27
.19 - .25