ATA555812C-DBB Atmel, ATA555812C-DBB Datasheet - Page 48

• Manufacturer Part Number: ATA555812C-DBB
• Description: IC IDIC 1KBIT R/W SAWN WAFER
• Manufacturer: Atmel

Specifications of ATA555812C-DBB

• Function: Read/Write
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 10-7. Die in Waffle Pack (Type 11 and Type 12/14, Standard Pads, Type 12/14 Mega Pads)
48
ATA5558
20:1
Package Drawing Contact:
[e-mail]
Chip Dimensions ATA5558 standard pads
1.62
0.186
2.4
0.165
B0
0.07
TITLE
Chip Dimensions
ATA5558
Chip orientation
Chip Dimensions ATA5558 mega pads
324 pc/tray
Chip identification ATA5558
(standard-pads)
Chip identification ATA5558
(mega-pads)
0.486
0.315
Dimensions in mm
(Unit of Measure = mm)
1.75
A0
Material: PS, black,
K0
Tray: H20-069x12
5:1
DIMENSIONS
technical drawings
according to DIN
specifications
COMMON
conductive
DRAWING NO.
9.920-6708.01-4
1.75
B0
0.305
4681E–RFID–11/09
K0
08/12/09
REV.
1