AD630BD Analog Devices Inc, AD630BD Datasheet - Page 3

• Manufacturer Part Number: AD630BD
• Description: IC MOD/DEMOD BAL 2MHZ 20-CDIP
• Manufacturer: Analog Devices Inc

Specifications of AD630BD

• Rohs Status: RoHS non-compliant
• Function: Modulator/Demodulator
• Frequency: 2MHz
• Package / Case: 20-CDIP (0.300", 7.62mm)
• Rf Type: Balanced
• Supply Voltage Range: ± 5V To ± 16V
• Rf Ic Case Style: DIP
• No. Of Pins: 20
• Operating Temperature Range: -25°C To +85°C
• Peak Reflow Compatible (260 C): No
• Mounting Type: Through Hole
• Supply Voltage Min: 5V
• Rohs Compliant: No
• Digital Ic Case Style: DIP
• Ic Function: Balanced Modulator/Demodulator
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Internal Power Dissipation . . . . . . . . . . . . . . . . . . . . 600 mW
Output Short-Circuit to Ground . . . . . . . . . . . . . . . Indefinite
Storage Temperature, Ceramic Package . . . –65°C to +150°C
Storage Temperature, Plastic Package . . . . . –55°C to +125°C
Lead Temperature Range (Soldering, 10 sec) . . . . . . . . 300°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150°C
REV. E
CHIP AVAILABILITY
The AD630 is available in laser trimmed, passivated chip
form. The figure above shows the AD630 metallization pattern,
bonding pads and dimensions. AD630 chips are available; con-
sult factory for details.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD630 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
CHIP METALLIZATION AND PINOUT
Model
AD630JN
AD630KN
AD630AR
AD630AR-REEL
AD630AD
AD630BD
AD630SD
AD630SD/883B
5962-8980701RA
AD630SE/883B
5962-89807012A
AD630JCHIPS
AD630SCHIPS
Dimensions shown in inches and (millimeters).
Contact factory for latest dimensions.
Temperature Ranges
0°C to 70°C
0°C to 70°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
0°C to 70°C
–55°C to +125°C
ORDERING GUIDE
Package Description
PDIP
PDIP
SOIC
SOIC 13" Tape and Reel
SBDIP
SBDIP
SBDIP
SBDIP
SBDIP
CLCC
CLCC
Chip
Chip
–3–
20-Lead PDIP (N)
20-Lead Ceramic DIP (D)
20-Lead Leadless Chip Carrier LCC (E)
20-Lead SOIC (R-20)
CHANNEL STATUS B/A
CHANNEL STATUS B/A
DIFF OFF ADJ
CM OFF ADJ
CM OFF ADJ
20-Lead SOIC, PDIP, and CERDIP
DIFF OFF ADJ
DIFF OFF ADJ
THERMAL CHARACTERISTICS
CM OFF ADJ
CM OFF ADJ
–V
PIN CONFIGURATIONS
CH A+
SEL B
SEL A
S
R
–V
4
5
6
7
8
IN
Package Option
N-20
N-20
R-20
D-20
D-20
D-20
D-20
D-20
E-20A
E-20A
20-Terminal CLCC
R-20
A
S
10
8
9
1
2
3
4
5
6
7
3
9 10 11 12 13
(Not to Scale)
(Not to Scale)
TOP VIEW
TOP VIEW
2
AD630
AD630
1
20 19
20
19
18
17
16
15
14
13
12
11
CH A–
CH B–
CH B+
R
R
R
R
V
COMP
+V
OUT
IN
A
F
B
18
17
16
15
14
S
B
24°C/W
35°C/W
35°C/W
38°C/W
CH B+
R
R
R
R
JC
IN
A
F
B
B
AD630
61°C/W
120°C/W
120°C/W
75°C/W
JA