UPG2214TB-A CEL, UPG2214TB-A Datasheet - Page 11

• Manufacturer Part Number: UPG2214TB-A
• Description: IC SWITCH SPDT 6-SMINI
• Manufacturer: CEL

Specifications of UPG2214TB-A

• Rf Type: 802.11a/b/g/Wi-Fi, 802.16/WiMax, WLAN
• Frequency: 50MHz ~ 3GHz
• Features: SPDT
• Package / Case: SC-70-6, SC-88, SOT-363
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: UPG2214TB-E4-A

Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
RECOMMENDED SOLDERING CONDITIONS
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Caution
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Do not use different soldering methods together (except for partial heating).
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
Soldering Conditions
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Condition Symbol
WS260
VP215
HS350
IR260
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
12//16/2004