UPG2015TB-A CEL, UPG2015TB-A Datasheet - Page 9

• Manufacturer Part Number: UPG2015TB-A
• Description: IC SWITCH SPDT 6-SMINI
• Manufacturer: CEL

Specifications of UPG2015TB-A

• Rf Type: 802.15.1/Bluetooth, Cellular, PCS, WLAN, WLL
• Frequency: 50MHz ~ 2.5GHz
• Features: SPDT
• Package / Case: SC-70-6, SC-88, SOT-363
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected
to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify
CEL for all damages resulting from such improper use or sale.
RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your nearby sales office.
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Caution
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
Soldering Method
Do not use different soldering methods together (except for partial heating).
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
Soldering Conditions
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Condition Symbol
WS260
VP215
HS350
IR260
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
02/19/2004