GA400TD25S Vishay, GA400TD25S Datasheet

IGBT FAST 250V 400A INT-A-PAK

GA400TD25S

Manufacturer Part Number
GA400TD25S
Description
IGBT FAST 250V 400A INT-A-PAK
Manufacturer
Vishay
Datasheet

Specifications of GA400TD25S

Configuration
Half Bridge
Voltage - Collector Emitter Breakdown (max)
250V
Vce(on) (max) @ Vge, Ic
1.6V @ 15V, 400A
Current - Collector (ic) (max)
400A
Current - Collector Cutoff (max)
500µA
Input Capacitance (cies) @ Vce
36nF @ 30V
Power - Max
1350W
Input
Standard
Ntc Thermistor
No
Mounting Type
Chassis Mount
Package / Case
Dual INT-A-PAK (3 + 8)
Collector- Emitter Voltage Vceo Max
250 V
Continuous Collector Current At 25 C
400 A
Maximum Operating Temperature
+ 150 C
Maximum Gate Emitter Voltage
+/- 20 V
Minimum Operating Temperature
- 40 C
Mounting Style
Screw
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Igbt Type
-
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant, Lead free / RoHS Compliant
Other names
*GA400TD25S
VS-GA400TD25S
VS-GA400TD25S
VSGA400TD25S
VSGA400TD25S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
GA400TD25S
Manufacturer:
SANYO
Quantity:
2 100
Part Number:
GA400TD25S
Quantity:
57
Part Number:
GA400TD25S-703058
Manufacturer:
SEMIKRON
Quantity:
492
• Generation 4 IGBT technology
• Standard: Optimized for minimum saturation
• Very low conduction and switching losses
• HEXFRED
• Industry standard package
• UL approved
• Increased operating efficiency
• Direct mounting to heatsink
• Performance optimized for power conversion: UPS,
• Lower EMI, requires less snubbing
Absolute Maximum Ratings
"HALF-BRIDGE" IGBT DUAL INT-A-PAK
Benefits
Features
Features
Features
Features
Features
Thermal / Mechanical Characteristics
V
I
I
I
I
V
V
P
P
T
T
www.irf.com
R
R
R
SMPS, Welding
recovery
C
CM
LM
FM
voltage and operating frequencies up to 10kHz
CES
GE
ISOL
D
D
J
STG
@ T
CS
JC
JC
@ T
@ T
C
C
C
= 25°C
= 25°C
= 85°C
antiparallel diodes with ultra- soft
Collector-to-Emitter Voltage
Continuous Collector Current
Pulsed Collector CurrentQ
Peak Switching CurrentR
Peak Diode Forward Current
Gate-to-Emitter Voltage
RMS Isolation Voltage, Any Terminal To Case, t = 1 min
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction Temperature Range
Storage Temperature Range
Thermal Resistance, Junction-to-Case - IGBT
Thermal Resistance, Junction-to-Case - Diode
Thermal Resistance, Case-to-Sink - Module
Mounting Torque, Case-to-Heatsink S
Mounting Torque, Case-to-Terminal 1, 2 & 3S
Weight of Module
Parameter
Parameter
GA400TD25S
-40 to +150
-40 to +125
Max.
2500
1350
Standard Speed IGBT
250
400
800
800
800
±20
700
Typ.
400
0.1
@V
V
GE
CE
V
CES
=
(on) typ.
15V
Max.
0.09
0.20
6.0
5.0
=
,
PD -50051D
250
I
C
= 1.3V
=
V
05/15/02
400A
Units
Units
°C/W
N m
°C
W
V
A
V
g
.
1

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GA400TD25S Summary of contents

Page 1

... Thermal / Mechanical Characteristics Parameter R Thermal Resistance, Junction-to-Case - IGBT JC R Thermal Resistance, Junction-to-Case - Diode JC R Thermal Resistance, Case-to-Sink - Module CS Mounting Torque, Case-to-Heatsink S Mounting Torque, Case-to-Terminal 1, 2 & 3S Weight of Module www.irf.com PD -50051D GA400TD25S Standard Speed IGBT 250 CES V = 1.3V CE (on) typ 15V 400A @V ...

Page 2

... GA400TD25S Electrical Characteristics @ T Parameter V Collector-to-Emitter Breakdown Voltage (BR)CES V Collector-to-Emitter Voltage CE(on) V Gate Threshold Voltage GE(th Temperature Coeff. of Threshold Voltage — GE(th Forward TransconductanceT fe I Collector-to-Emitter Leaking Current CES V Diode Forward Voltage - Maximum FM I Gate-to-Emitter Leakage Current GES Dynamic Characteristics - T Parameter Q Total Gate Charge (turn-on) ...

Page 3

... V , Collector-to-Emitter Voltage (V) CE Fig Typical Output Characteristics www.irf.com 1 f, Frequency (kHz) (Load Current = I of fundamental) RMS 1000  T = 150 C 100 = 15V 10 5 2.0 Fig Typical Transfer Characteristics GA400TD25S ° sink = 9 0 ° riv ifie tio 125° 50V 25V CC CE 80µ ...

Page 4

... GA400TD25S Case Temperature (°C) C Fig Maximum Collector Current vs. Case Temperature 0.5 0 0.20 0. 0.05 0 Fig Maximum Effective Transient Thermal Impedance, Junction-to-Case 4 2 PULSE WIDTH 1.5 A 1.0 -60 -40 - Fig Typical Collector-to-Emitter Voltage vs. Junction Temperature Notes: 1. Duty factor Peak cta ng ula lse D u ratio n (se c) ...

Page 5

... 200V CC C SHORTED 100 0 Fig Typical Gate Charge vs.  1000 R = 100 10 -60 -40 - Fig Typical Switching Losses vs. GA400TD25S = 400V = 440A 400 800 1200 Q , Total Gate Charge (nC) G Gate-to-Emitter Voltage = 0 = Ohm G2 = 15V = 150V  800 400 200 100 120 140 160 T , Junction Temperature ( C ) ° ...

Page 6

... GA400TD25S  100 R = Ohm 125° 150 C ° 150V 15V 200 400 600 I , Collector-to-emitter Current (A) C Fig Typical Switching Losses vs. Collector-to-Emitter Current 5° ° 0.0 0.5 1.0 1.5 2 lta Fig Typical Forward Voltage Drop vs. Instantaneous Forward Current 800 1000 0 V Fig Reverse Bias SOA ...

Page 7

... ° 5° /dt - (A/µ s) Fig Typical Reverse Recovery vs. di www.irf.com 800A 800A 400A 400A 200A 200A ° ° /dt Fig Typical Recovery Current vs GA400TD25S /dt - (A/µ / ...

Page 8

... GA400TD25S Fig Test Circuit for Measurement off(diode d(on Fig Test Waveforms for Circuit of Fig. 17, Defining d(on ff d(off) f Fig Test Waveforms for Circuit of Fig. 17, Defining Vce Fig Test Waveforms for Circuit of Fig. 17 µ S Vce d(off) f trr trr Irr V cc Irr Defining rec ...

Page 9

... Figure 21 480V Figure 22. www.irf.com GA400TD25S 150V @25° ...

Page 10

... GA400TD25S Notes: Q Repetitive rating 20V, pulse width limited by GE max. junction temperature. R See fig For screws M6. T Pulse width 80µs; single shot. Case Outline — DUAL INT-A-PAK 107.30 [ 4.224 ] 106.30 4.185 93.30 [ 3.673 ] 92.70 3.650 [.314] 2X MAX 48.30 1.902 47.70 1.878 ...

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