BLF7G22LS-200,118 NXP Semiconductors, BLF7G22LS-200,118 Datasheet

TRANSISTOR PWR LDMOS SOT502

BLF7G22LS-200,118

Manufacturer Part Number
BLF7G22LS-200,118
Description
TRANSISTOR PWR LDMOS SOT502
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLF7G22LS-200,118

Package / Case
SOT502B
Transistor Type
LDMOS
Frequency
2.11GHz ~ 2.17GHz
Gain
18.5dB
Voltage - Rated
65V
Current Rating
29.5A
Current - Test
1.62A
Voltage - Test
28V
Power - Output
30W
Mounting Style
SMD/SMT
Configuration
Single
Drain-source Breakdown Voltage
65 V
Continuous Drain Current
29.5 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
200 W LDMOS power transistor for base station applications at frequencies from
2110 MHz to 2170 MHz.
Table 1.
Typical RF performance at T
[1]
Mode of operation
2-carrier W-CDMA
BLF7G22L-200;
BLF7G22LS-200
Power LDMOS transistor
Rev. 3 — 1 April 2011
Excellent ruggedness
High efficiency
Low R
Designed for low memory effects providing excellent pre-distortability
Internally matched for ease of use
Integrated ESD protection
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
RF power amplifiers for W-CDMA base stations and multi carrier applications in the
2110 MHz to 2170 MHz frequency range
Test signal: 3GPP; test model 1; 64 DPCH; PAR = 8.4 dB at 0.01 % probability on CCDF;
carrier spacing 5 MHz.
th
Typical performance
providing excellent thermal stability
f
(MHz)
2110 to 2170
case
= 25
°
C in a common source class-AB production test circuit.
I
(mA)
1620
Dq
V
(V)
28
DS
P
(W)
55
L(AV)
Preliminary data sheet
G
(dB)
18.5
p
η
(%)
31
D
ACPR
(dBc)
−31
[1]

Related parts for BLF7G22LS-200,118

BLF7G22LS-200,118 Summary of contents

Page 1

... BLF7G22L-200; BLF7G22LS-200 Power LDMOS transistor Rev. 3 — 1 April 2011 1. Product profile 1.1 General description 200 W LDMOS power transistor for base station applications at frequencies from 2110 MHz to 2170 MHz. Table 1. Typical RF performance at T Mode of operation 2-carrier W-CDMA [1] Test signal: 3GPP; test model 1; 64 DPCH; PAR = 8 0.01 % probability on CCDF; ...

Page 2

... NXP Semiconductors 2. Pinning information Table 2. Pin BLF7G22L-200 (SOT502A BLF7G22LS-200 (SOT502B [1] Connected to flange. 3. Ordering information Table 3. Type number BLF7G22L-200 BLF7G22LS-200 4. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol stg Thermal characteristics Table 5. Symbol Parameter R th(j-c) BLF7G22L-200_7G22LS-200 Preliminary data sheet BLF7G22L-200 ...

Page 3

... Symbol P L(AV η D ACPR 7.1 Ruggedness in class-AB operation The BLF7G22L-200 and BLF7G22LS-200 are capable of withstanding a load mismatch corresponding to VSWR = through all phases under the following conditions BLF7G22L-200_7G22LS-200 Preliminary data sheet BLF7G22L-200; BLF7G22LS-200 Characteristics C unless otherwise specified. drain-source breakdown voltage V gate-source threshold voltage ...

Page 4

... 1620 mA ( 2110 MHz ( 2140 MHz ( 2170 MHz Fig 2. Power gain as a function of average load power; typical values BLF7G22L-200_7G22LS-200 Preliminary data sheet BLF7G22L-200; BLF7G22LS-200 Typical impedance = 1620 mA [ (Ω) 1.05 − j4.04 1.18 − j4.17 1.32 − j4.68 1.58 − j4.37 2.55 − j5.14 ...

Page 5

... Power gain and drain efficiency as functions of average load power; typical values = 1620 mA; PAR = 7 0.01 % probability on the CCDF ( 2110 MHz ( 2140 MHz ( 2170 MHz Fig 6. Adjacent power channel ratio (5 MHZ) as function of average load power; typical values BLF7G22L-200_7G22LS-200 Preliminary data sheet BLF7G22L-200; BLF7G22LS-200 001aan066 50 η D (%) 100 ...

Page 6

... 1620 mA; Channel Spacing = 5 MHz PAR = 8 0.01 % probability on the CCDF. ( 2110 MHz ( 2140 MHz ( 2170 MHz Fig 9. Drain efficiency as function of average load power; typical values BLF7G22L-200_7G22LS-200 Preliminary data sheet BLF7G22L-200; BLF7G22LS-200 001aan069 50 19.0 η (%) (dB) 40 18.6 30 18.2 20 17.8 10 17.4 0 17.0 80 120 ...

Page 7

... C10 C11 C12 C13, C14 C15 R1 [1] TDK or capacitor of same quality. [2] American Technical Ceramics type 100B or capacitor of same quality. BLF7G22L-200_7G22LS-200 Preliminary data sheet BLF7G22L-200; BLF7G22LS-200 C10 C5 50.000 mm List of components for component layout. Description multilayer ceramic chip capacitor multilayer ceramic chip capacitor ...

Page 8

... UNIT 12.83 4.72 0.15 20.02 mm 12.57 3.43 0.08 19.61 0.505 0.186 0.006 0.788 inches 0.135 0.495 0.772 0.003 OUTLINE VERSION IEC SOT502A Fig 12. Package outline SOT502A BLF7G22L-200_7G22LS-200 Preliminary data sheet BLF7G22L-200; BLF7G22LS-200 scale 19.96 9.50 9.53 1.14 19.94 5.33 19.66 9.30 9 ...

Page 9

... DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) c UNIT 12.83 4.72 0.15 20.02 mm 12.57 3.43 0.08 19.61 0.505 0.186 0.006 0.788 inches 0.135 0.495 0.772 0.003 OUTLINE VERSION IEC SOT502B Fig 13. Package outline SOT502B BLF7G22L-200_7G22LS-200 Preliminary data sheet BLF7G22L-200; BLF7G22LS-200 scale 19.96 9.50 9.53 1.14 19.94 5.33 19.66 9 ...

Page 10

... Revision history Document ID BLF7G22L-200_7G22LS-200 v.3 20110401 Modifications: BLF7G22L-200_7G22LS-200 v.2 20101228 BLF7G22L-200_7G22LS-200 v.1 20100419 BLF7G22L-200_7G22LS-200 Preliminary data sheet BLF7G22L-200; BLF7G22LS-200 Abbreviations Description Third Generation Partnership Project Complementary Cumulative Distribution Function Continuous Wave Dedicated Physical CHannel Laterally Diffused Metal Oxide Semiconductor Laterally Diffused Metal Oxide Semiconductor Transistor ...

Page 11

... BLF7G22L-200_7G22LS-200 Preliminary data sheet BLF7G22L-200; BLF7G22LS-200 [3] Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. ...

Page 12

... For sales office addresses, please send an email to: BLF7G22L-200_7G22LS-200 Preliminary data sheet BLF7G22L-200; BLF7G22LS-200 NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 13

... Trademarks Contact information Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 BLF7G22L-200; BLF7G22LS-200 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Power LDMOS transistor All rights reserved ...

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