XC2V2000-4BF957I Xilinx Inc, XC2V2000-4BF957I Datasheet - Page 49

• Manufacturer Part Number: XC2V2000-4BF957I
• Description: IC FPGA VIRTEX-II 957FCBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-IIr

Specifications of XC2V2000-4BF957I

• Number Of Labs/clbs: 2688
• Total Ram Bits: 1032192
• Number Of I /o: 624
• Number Of Gates: 2000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 957-BBGA, FCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Logic Elements/cells: -

DS031-3 (v3.5) November 5, 2007
Virtex-II Electrical Characteristics
Virtex-II™ devices are provided in -6, -5, and -4 speed
grades, with -6 having the highest performance.
Virtex-II DC and AC characteristics are specified for both
commercial and industrial grades. Except the operating
temperature range or unless otherwise noted, all the DC
and AC electrical parameters are the same for a particular
speed grade (that is, the timing characteristics of a -4 speed
grade industrial device are the same as for a -4 speed grade
Virtex-II DC Characteristics
Table 1: Absolute Maximum Ratings
© 2000–2007 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other
trademarks are the property of their respective owners.
DS031-3 (v3.5) November 5, 2007
Product Specification
Notes:
1.
2.
3.
Symbol
V
V
V
V
V
V
T
T
Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to
Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
For soldering guidelines and thermal considerations, see the
website.
Inputs configured as PCI are fully PCI compliant. This statement takes precedence over any specification that would imply that the device is not PCI
compliant.
CCAUX
CCINT
V
BATT
IN
CCO
STG
T
REF
SOL
TS
J
(3)
Internal supply voltage relative to GND
Auxiliary supply voltage relative to GND
Output drivers supply voltage relative to GND
Key memory battery backup supply
Input reference voltage
Input voltage relative to GND (user and dedicated I/Os)
Voltage applied to 3-state output (user and dedicated I/Os)
Storage temperature (ambient)
Maximum soldering temperature
Maximum junction temperature
R
4
4
(2)
(2)
Description
All regular FF/BF flip-chip and
FG/BG/CS wire-bond packages
Pb-free FGG456, FGG676, BGG575,
and BGG728 wire-bond packages
Pb-free FGG256 and CSG144
wire-bond packages
Device Packaging and Thermal Characteristics Guide
www.xilinx.com
(1)
DC and Switching Characteristics
commercial device). However, only selected speed grades
and/or devices might be available in the industrial range.
All supply voltage and junction temperature specifications
are representative of worst-case conditions. The parame-
ters included are common to popular designs and typical
applications. Contact Xilinx for design considerations
requiring more detailed information.
All specifications are subject to change without notice.
Virtex-II Platform FPGAs:
–0.5 to V
–0.5 to V
–0.5 to 1.65
–65 to +150
–0.5 to 4.0
–0.5 to 4.0
–0.5 to 4.0
–0.5 to 4.0
+220
+250
+260
+125
Product Specification
information on the Xilinx
CCO
CCO
+ 0.5
+ 0.5
Module 3 of 4
Units
°C
°C
°C
°C
°C
V
V
V
V
V
V
V
1