TFBS4650-TR3 Vishay, TFBS4650-TR3 Datasheet - Page 7

• Manufacturer Part Number: TFBS4650-TR3
• Description: Infrared Transceivers SIR 115.2 kbits/s 2.4-3.6V Op Voltage
• Manufacturer: Vishay

Specifications of TFBS4650-TR3

• Wavelength: 886 nm
• Continual Data Transmission: 115.2 Kbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 25 mW/sr
• Pulse Width: 2 us
• Maximum Rise Time: 100 ns
• Maximum Fall Time: 100 ns
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 6.8 mm x 2.8 mm x 1.6 mm
• Data Rate: 115.2kbs (SIR)
• Idle Current, Typ @ 25° C: 75µA
• Link Range, Low Power: 50cm
• Operating Temperature: -25°C ~ 85°C
• Orientation: Side View
• Shutdown: *
• Size: 6.8mm x 2.8mm x 1.6mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.4 V ~ 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

RECOMMENDED SOLDER PROFILES
Solder Profile for Sn/Pb Soldering
Lead (Pb)-free, Recommended Solder Profile
The TFBS4650 is a lead (Pb)-free transceiver and qualified
for lead (Pb)-free processing. For lead (Pb)-free solder paste
like Sn
profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike
(RTS). The Ramp-Soak-Spike profile was developed
primarily for reflow ovens heated by infrared radiation. With
widespread use of forced convection reflow ovens the
Ramp-To-Spike profile is used increasingly. Shown in
figure 3 is Vishay’s recommended profiles for use with the
TFBS4650 transceivers. For more details please refer to the
application note “SMD Assembly Instructions”.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices wave
soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However,
recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless,
we added a chapter to the above mentioned application note,
describing manual soldering and desoldering.
Storage
The storage and drying processes for all Vishay transceivers
(TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels on the
packing and also in the application note “Taping, Labeling,
Storage and Packing”.
Document Number: 84672
Rev. 1.5,16-Sep-09
19431
Fig. 2 - Recommended Solder Profile for Sn/Pb Soldering
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
(3.0 - 4.0)
2 °C/s to 4 °C/s
for
50
Ag
a
(0.5 - 0.9)
100
Infrared Transceiver, 9.6 kbit/s to 115.2 kbit/s (SIR)
production
160 °C max.
240 °C max.
120 s to 180 s
[e-mail], [e-mail],
Cu, there are two standard reflow
150
Time (s)
For technical questions within your region, please contact one of the following:
2 °C/s to 4 °C/s
200
process
10 s max. at 230 °C
250
90 s max.
it
300
cannot
350
be
19261
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2 °C...4 °C/s
Fig. 3 - Solder Profile, RSS Recommendation
[e-mail]
50
T ≥ 255 °C for 20 s max
T ≥ 217 °C for 50 s max
100
90 s...120 s
Vishay Semiconductors
150
Time/s
200
50 s max.
20 s
TFBS4650
T peak = 260 °C max.
250
www.vishay.com
2 °C...4 °C/s
300
350
7