1203S08-U THAT Corporation, 1203S08-U Datasheet - Page 12

• Manufacturer Part Number: 1203S08-U
• Description: Difference Amplifiers High-CMRR Bal Input Line Rec. -3dB SO-8
• Manufacturer: THAT Corporation

Specifications of 1203S08-U

• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Operating Temperature Range: 0 C to + 85 C
• Output Current: +/- 25 mA
• Operating Supply Voltage: +/- 18 V
• Package / Case: SOIC-8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Page 12
mini-DIP and 8-pin SOIC packages. The package di-
mensions are shown in Figures 17 and 18 below,
while pinouts are given in Table 1 on page 1.
"green" packages (both SO and DIP). The lead frames
are copper, plated with successive layers of nickel
paladium, and gold. This approach makes it possible
to
lead-bearing solders. The plastic mold compound
contains no hazardous substances as specified in the
RoHS directive.
D
The THAT 1200 series is available in both 8-pin
The 1200 series is available only in lead-free,
Figure 17. -S (SO) version package outline drawing
1
solder
ITEM
a1
A
B
C
D
E
F
G
H
h
E
A
these
MILLIMETERS
3.81/3.99
5.84/6.20
0.36/0.46
1.27
1.52/1.73
0.18/0.25
0.41/0.89
0.31/0.71
4.78/5.00
0.10/0.20
THAT Corporation; 45 Sumner Street; Milford, Massachusetts 01757-1656; USA
a1
devices
B
Tel: [phone]; Fax: [phone]; Web: www.thatcorp.com
C
Package and Soldering Information
using
INCHES
0.188/0.197
0.004/0.008
0.150/0.157
0.230/0.244
0.014/0.018
0.050
0.060/0.068
0.007/0.010
0.016/0.035
0.012/0.027
hx45°
0-8°
lead-free
G
F
and
H
using reflow temperatures as high as 260°C for 10
seconds. This makes them suitable for use in a 100%
tin solder process. Furthermore, the 1200 series has
been qualified to a JEDEC moisture sensitivity level
of MSL1. No special humidity precautions are re-
quired prior to flow soldering the parts.
to a soldering temperature of 300 °C for up to 10 sec-
onds.
InGenius High-CMRR Balanced Input Line Receiver ICs
K
The surface-mount package has been qualified
The through-hole package leads can be subjected
Figure 18. -P (DIP) version package outline drawing
D
ITEM
1
C
D
G
H
A
B
E
F
K
J
MILLIMETERS
9.52 0.10
6.35 0.10
7.49/8.13
0.46
2.54
3.68/4.32
0.25
3.18 0.10
8.13/9.40
3.30 0.10
A
E
±
±
±
±
B
F
H
C
INCHES
0.375
0.250 0.004
0.295/0.320
0.018
0.100
0.145/0.170
0.010
0.125 0.004
0.320/0.370
0.130 0.004
±0.004
±
±
±
G
J