FM22L16-55-TG Ramtron, FM22L16-55-TG Datasheet

F-RAM 4M (256Kx16) 55ns

FM22L16-55-TG

Manufacturer Part Number
FM22L16-55-TG
Description
F-RAM 4M (256Kx16) 55ns
Manufacturer
Ramtron
Datasheet

Specifications of FM22L16-55-TG

Organization
256 Kbit x 16
Access Time
55 ns
Operating Supply Voltage
2.7 V to 3.6 V
Operating Temperature Range
- 40 C to + 85 C
Mounting Style
SMD/SMT
Memory Size
4 Mbit
Interface
Parallel
Package / Case
TSOP-44
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Pre-Production
FM21L16
2Mbit F-RAM Memory
Features
2Mbit Ferroelectric Nonvolatile RAM
SRAM Compatible
Advanced Features
Description
The FM21L16 is a 128Kx16 nonvolatile memory that
reads and writes like a standard SRAM. A
ferroelectric random access memory or F-RAM is
nonvolatile, which means that data is retained after
power is removed. It provides data retention for over
10 years while eliminating the reliability concerns,
functional
complexities of battery-backed SRAM (BBSRAM).
Fast write timing and high write endurance make the
F-RAM superior to other types of memory.
In-system operation of the FM21L16 is very similar
to other RAM devices and can be used as a drop-in
replacement for standard SRAM. Read and write
cycles may be triggered by /CE or simply by
changing the address. The F-RAM memory is
nonvolatile due to its unique ferroelectric memory
process. These features make the FM21L16 ideal for
nonvolatile memory applications requiring frequent
or rapid writes in the form of an SRAM.
The FM21L16 includes a low voltage monitor that
blocks access to the memory array when V
below V
inadvertent access and data corruption under this
condition. The device also features software-
controlled write protection. The memory array is
divided into 8 uniform blocks, each of which can be
individually write protected.
This is a product in the pre-production phase of development. Device
characterization is complete and Ramtron does not expect to change the
specifications. Ramtron will issue a Product Change Notice if any
specification changes are made.
Rev. 2.0
Apr. 2011
Organized as 128Kx16
Configurable as 256Kx8 Using /UB, /LB
10
NoDelay™ Writes
Page Mode Operation to 33MHz
Advanced High-Reliability Ferroelectric Process
Industry Std. 128Kx16 SRAM Pinout
60 ns Access Time, 110 ns Cycle Time
Software Programmable Block Write Protect
14
DD
Read/Write Cycles
min. The memory is protected against an
disadvantages,
and
system
DD
design
drops
Superior to Battery-backed SRAM Modules
Low Power Operation
Industry Standard Configuration
The device is available in a 400 mil 44-pin TSOP-II
surface mount package. Device specifications are
guaranteed over industrial temperature range –40°C
to +85°C.
Pin Configuration
FM21L16-60-TG
FM21L16-60-TGTR
No Battery Concerns
Monolithic Reliability
True Surface Mount Solution, No Rework Steps
Superior for Moisture, Shock, and Vibration
2.7V – 3.6V Power Supply
Low Current Mode (5µA) using ZZ pin
Low Active Current (8 mA typ.)
Industrial Temperature -40 C to +85 C
44-pin “Green”/RoHS TSOP-II package
1850 Ramtron Drive, Colorado Springs, CO 80921
Ordering Information
Ramtron International Corporation
60 ns access, 44-pin
“Green”/RoHS TSOP-II
60 ns access, 44-pin
“Green”/RoHS TSOP-II,
Tape & Reel
(800) 545-FRAM, (719) 481-7000
http://www.ramtron.com
Page 1 of 15

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FM22L16-55-TG Summary of contents

Page 1

... This is a product in the pre-production phase of development. Device characterization is complete and Ramtron does not expect to change the specifications. Ramtron will issue a Product Change Notice if any specification changes are made. Rev. 2.0 Apr ...

Page 2

... Input Chip Enable input: The device is selected and a new memory access begins when /CE is low and /ZZ is high. The entire address is latched internally on the falling edge of /CE. Subsequent changes to the A(1:0) address inputs allow page mode operation when /CE is low. ...

Page 3

Functional Truth Table /CE /WE A(16: Change L H Change Change X X Notes: 1) H=Logic High, L=Logic Low, V=Valid Data, X=Don’t ...

Page 4

... Read Operation A read operation begins on the falling edge of /CE. The falling edge of /CE causes the address to be latched and starts a memory read cycle if /WE is high. Data becomes available on the bus after the access time has been satisfied. Once the address has been ...

Page 5

... Precharge Operation The precharge operation is an internal condition in which the state of the memory is being prepared for a new access. Precharge is user-initiated by driving the /CE signal high. It must remain high for at least the minimum precharge time Precharge is also activated by changing the upper addess A(16:2). The current row is first closed prior to accessing the new row ...

Page 6

A flow chart of the entire write protect operation is shown in For example, the following sequence write-protects addresses from 0C000h to 13FFFh ...

Page 7

Figure 4. Sequence to Set Write-Protect Blocks Note: This sequence requires t Figure 5. Sequence to Read Write-Protect Settings Note: This sequence requires t Rev. 2.0 Apr. 2011 ≥ 10ns and address must be stable while /CE is low. AS ...

Page 8

... The /UB and /LB byte select pins are active for both read and write cycles. They may be used to allow the device to be wired as a 256Kx8 memory. The upper and lower data bytes can be tied together and controlled with the byte selects. Individual byte ...

Page 9

Electrical Specifications Absolute Maximum Ratings Symbol Description V Power Supply Voltage with respect Voltage on any signal pin with respect Storage Temperature STG T Lead Temperature (Soldering, 10 seconds) LEAD V Electrostatic ...

Page 10

Read Cycle AC Parameters ( Symbol Parameter t Read Cycle Time RC t Chip Enable Access Time CE t Address Access Time AA t Output Hold Time OH t Page Mode ...

Page 11

... Sleep Mode Exit Time (/ZZ high to 1 ZZEX Notes 1. Slope measured at any point Ramtron cannot test or characterize all V when V is below the level of a transistor threshold voltage. Ramtron strongly recommends that V DD 100ms through the range of 0.4V to 1.0V 2.7V to 3.6V) Data Retention DD Parameter Data Retention ...

Page 12

Page Mode Read Cycle Timing Although sequential column addressing is shown not required. Write Cycle Timing 1 (/WE-Controlled) Write Cycle Timing 2 (/CE-Controlled) CE A(17:0) WE DQ(15:0) UB/LB Rev. 2.0 Apr. 2011 Note: /OE (not shown) is low ...

Page 13

Write Cycle Timing 3 (/CE low) Note: /OE (not shown) is low only to show effect of / pins Page Mode Write Cycle Timing Although sequential column addressing is shown not required. Power Cycle and Sleep ...

Page 14

... XXXXXX= part number, S= speed, P=package RAMTRON XXXXXXX-S-P LLLLLL= lot code, YY=year, WW=work week LLLLLLL YYWW Examples: FM21L16, 60ns access time, “Green”/RoHS TSOP-II package, Lot 6340282, Year 2007, Work Week 31 RAMTRON FM21L16-60-TG 6340282 0731 Rev. 2.0 Apr. 2011 Recommended PCB Footprint 18.41 ...

Page 15

Revision History Revision Date 1.0 9/24/2007 1.1 12/12/2007 1.2 12/22/2009 2.0 4/4/2011 Rev. 2.0 Apr. 2011 Summary Initial release. Added package MSL rating and placeholder for ESD ratings. Lowered I limit. Added UB/LB signals to timing diagrams and added DD ...

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