NCP18XW472J03RB Murata, NCP18XW472J03RB Datasheet - Page 7

• Manufacturer Part Number: NCP18XW472J03RB
• Description: Thermistors - NTC 4.7K OHM 5%
• Manufacturer: Murata
• Type: NTCr
• Series: NCPr

Specifications of NCP18XW472J03RB

• Resistance: 4.7 KOhms
• Tolerance: 5 %
• Termination Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 125 C
• Lead Spacing: 0.6 mm
• Power Rating: 100 mW
• Package / Case: 0603
• Thermistor Type: NTC
• Thermistor Tolerance: ± 5%
• Beta Value (k): 3500K
• Thermistor Case Style: 0603
• No. Of Pins: 2
• External Depth: 0.8mm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

No. JWB01BS - E2600A
3. Solder and Flux
4. For removing the flux after soldering, observe the following points in order to avoid
5. Do not give this product a strong press-force nor a mechanical shock. Because such
6. In your mounting process, observe the following points in order to avoid deterioration of the
(1) Solder Paste
(2) Flux:
(1) Cleaning Conditions
(2) Drying: After cleaning, dry promptly this product.
(1) Recommendable Land Size
(2) Printing Conditions of Solder Paste
mechanical forces may cause cracking or chipping of this ceramic product.
characteristics or destruction of this product. The mounting quality of this product may also
be affected by the mounting conditions, shown the points below.
deterioration of the characteristics or any change of the external electrodes quality.
i. Reflow Soldering: Use RA type or equivalent type of solder paste
ii. Reflow Soldering: Use RA type or equivalent type of solder paste
i. Recommendable thickness of solder paste printing shall be from 0.15 mm to 0.20 mm.
ii. After soldering, the solder fillet shall be a height from 0.2 mm to the thickness of this
iii. Too much solder gives too strong mechanical stress to this product, such stress may
Too big land size gives too much solder paste on the land. It may cause destruction of
this product, because of the mechanical stress especially in the case of board bending.
Isopropyl
For your reference, we are using ‘SPT-70-0F-2063’, manufactured by SENJU METAL
INDUSTRY CO., LTD (Sn:Pb:Ag=63:35:2wt%), for any Internal tests of this product.
Solvent
product. (See the figures below.)
cause cracking or any mechanical damage. And also, it can destroy the electrical
performance of this product.
Alcohol
a
b
Dipping Cleaning
Less than 5 min.
Less than 2 min.
at room temp.
at 40°C max.
MURATA MANUFACUTURING CO.,LTD.
c
(Sn:Pb:Ag=63:35:2wt%, Sn:Pb=60:40wt% or Sn:Pb=63:37wt%)
(Sn:Pb:Ag=63:35:2wt%, Sn:Pb=60:40wt% or Sn:Pb=63:37wt%)
Do not use strong acidic flux (with halide content exceeding 0.2wt%).
Use rosin-based flux.
or
Flow Soldering
Reflow Soldering
Frequency of several 10 KHz
Ultrasonic Cleaning
to several 100 KHz.
Less than 1 min.
20W/L
0.6 – 0.8
0.6 - 1.0
a
0.8 - 0.9
0.6 - 0.7
b
A sufficient cleaning
shall be applied to
remove flux completely.
(Unit : mm)
0.6 – 0.8
0.6 – 0.8
c
CN-018F
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