BLM18SG121TN1D Murata, BLM18SG121TN1D Datasheet - Page 201

• Manufacturer Part Number: BLM18SG121TN1D
• Description: EMI/RFI Suppressors & Ferrites 0603 120 OHMS
• Manufacturer: Murata

Specifications of BLM18SG121TN1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 120 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 3000 mAmps
• Maximum Dc Resistance: 0.025 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Termination Style: SMD/SMT
• Dc Resistance Max: 0.025ohm
• Dc Current Rating: 3A
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603 / 1608
• Operating Temperature Min: -55°C
• Resistance: 0.025ohm
• Rohs Compliant: Yes
• Operating Temperature Max: +125°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

BNX
(1) How to use effectively
This product effectively prevents undesired radiation and
external noise from going out / entering the circuit by
grounding the high frequency components which cause
noise problems. Therefore, grounding conditions may affect
the performance of the filter and attention should be paid to
the following for effective use.
(2) Self-heating
Though this product has a large rated current, localized
selfheating may be caused depending on soldering
conditions. To avoid this, attention should be paid to the
following:
!Note
BNX00p/01p
1. Mounting Hole
2. Using the Block Type
Mounting holes should be designed as specified below.
(a) Design maximized grounding area in the P.C. board,
(b) Minimize the distance between ground of the P.C.
(c) Insert the terminals into the holes on P.C. board
(d) Don't connect PSG terminal with CG terminal directly.
(a) Use P.C. board with our recommendation on hole
(b) Solder the terminals to the P.C. board with
(c) After installing this product in your product, please
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
and grounding pattern for all the grounding terminals
of the product to be connected. (Please follow the
specified recommendations.)
board and the ground plate of the product.
(Recommend unsing the through hole connection
between grounding area both of component side and
bottom side.)
completely.
(See the item 1. Terminal Layout)
diameter / land pattern dimensions, mentioned in the
right hand drawing, especially for 4 terminals which
pass current.
soldercover area at least 90%. Otherwise, excess self-
heating at connection between terminals and P.C.
board may lead to smoke and / or fire of the product
even when operating at rated current.
make sure the self-heating is within the rated current
recommended.
Block Type EMIFILr
EMIFILr
Component Side
(PSG)
(CG)
(Lead Type) Effectively
2.5 0.1
(CG)
5.0 0.1
7.5 0.1
(CB)
(B)
Lead Type
(CG)
ø1.2
Recommended Land Pattern
P. C. Board Patterns
(1) Component Side View
Use a bilateral P.C. board. Insert the BNX into the P.C.board until
the root of the terminal is secured, then solder.
Soldering and Mounting
PSG
CG
PSG
CG
CG
2.5
CB
Terminal Layout (Bottom figure)
CB
B
3.2
B
5.0
B
CG
3.2
CG
PSG
7.5
CG
PSG
3.2
B
CG
(2) Bottom View
CG
PSG: Power supply ground
CG: Load circuit ground
CB: Load circuit + Bias
B
B
CB
CG
Through holes
PSG
Copper foil pattern
PSG
CB
Copper foil pattern
CG
CG
(in mm)
ø1.2
Shield plate
199
Mar.28,2011
C31E.pdf