BLM18BA750SN1D Murata, BLM18BA750SN1D Datasheet - Page 180

• Manufacturer Part Number: BLM18BA750SN1D
• Description: EMI/RFI Suppressors & Ferrites 0603 75 OHM
• Manufacturer: Murata
• Series: BLM Br

Specifications of BLM18BA750SN1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 75 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 300 mAmps
• Maximum Dc Resistance: 0.7 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Termination Style: SMD/SMT
• Dc Resistance Max: 0.7ohm
• Dc Current Rating: 300mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603
• Inductor Case Style: 0603
• No. Of Pins: 2
• Core Material: Ferrite
• Resistance: 0.7ohm
• Rohs Compliant: Yes
• Operating Temperature Min: -55°C
• Operating Temperature Max: +125°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

6
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
178
EMIFILr (Soldering and Mounting)
BLA2A
BLA31
NFM18
NFL18
NFM55
NFM21
NFM3D
NFM31P
NFM41
NFR21G
NFL21S
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
oReflow soldering
Reflow Soldering
NFM18C/NFM18PC/
NFL18ST
The chip EMI filter suppresses noise by conducting the high-
frequency noise to ground. Therefore, to get enough noise reduction,
feed through holes which are connected to ground-plane should be
arranged according to the figure to reinforce the ground pattern.
• NFp18, NFp21, NFM55 are specially adapted for reflow soldering.
o Reflow Soldering
NFM21C/NFR21G
NFM21P/NFL21S
NFM3DC/NFM3DP
NFM31P
NFM41C/NFM41P
BLA2A
Small diameter thru hole ø0.4
NFM21C/NFR21G
NFM21P/NFL21S
a
c
d
Part Number
Small diameter thru hole
0.6
1.0
2.2
0.4
0.5 Pitch
1.75
ø0.2-ø0.3
0.25
Chip mounting side
0.05
0.6
1.0
1.0
1.5
a
• If there are high amounts of self-heating on pattern, the
1.4
1.4
2.0
NFM18PS
b
-
Small diameter thru hole
contact points of PCB and part may become damaged.
NFM3DC/NFM3DP/
NFM31P
NFM41C/NFM41P
0.8
1.2
2.0
1.4
2.5
2.5
3.5
c
Small diameter thru hole ø0.4
Size (mm)
a
b
c
d
2.6
4.4
4.4
6.0
d
0.8
1.0
1.2
1.2
e
ø0.2
1.9
2.0
2.6
2.6
f
2.3
2.4
3.0
3.0
0.8
0.8
g
oReflow and Flow
NFL18SP
Small diameter thru hole
BLA31
1.0
2.0
o Flow Soldering
Part Number
NFM3DC
NFM3DP
NFM31P
NFM41C
NFM41P
Chip mounting side
0.4
0.8 Pitch
ø0.2-ø0.3
2.8
1.0
1.0
1.5
a
0.4
Chip
Please contact us if using
thinner land pad than 18 m.
1.4
1.4
2.0
Continued on the following page.
b
2.5
2.5
3.5
c
NFM55P
Size (mm)
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
Small diameter thru hole
1.5
2.0
4.7
6.7
Small diameter
thru hole ø0.4
4.4
4.4
6.0
d
a
b
c
d
1.0
1.2
1.2
e
2.0
2.6
2.6
ø1.0-ø2.0
f
(in mm)
2.4
3.0
3.0
g
C31E.pdf
08.9.1