BLM18PG471SN1D Murata, BLM18PG471SN1D Datasheet - Page 92

• Manufacturer Part Number: BLM18PG471SN1D
• Description: EMI/RFI Suppressors & Ferrites 470 OHM
• Manufacturer: Murata
• Type: Chip Beadr

Specifications of BLM18PG471SN1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 470 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 1000 mAmps
• Maximum Dc Resistance: 0.2 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Termination Style: SMD/SMT
• Dc Resistance Max: 0.2ohm
• Dc Current Rating: 1A
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603 / 1608
• Rohs Compliant: Yes
• Inductance: Not RequireduH
• Core Material: Ferrite
• Tolerance (+ Or -): 25%
• Dc Resistance: 200mOhm
• Case Size (inches): 0603in
• Operating Temp Range: -55C to 125C
• Dc Current: 1A
• Product Diameter (mm): Not Requiredmm
• Product Height (mm): 0.95mm
• Product Depth (mm): 0.8mm
• Product Length (mm): 1.75mm
• Military Standard: Not Required
• Failure Rate: Not Required
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

!Note
90
Chip Ferrite Bead
1. Cleaning
2. Soldering
3. Other
<Operating Environment>
Do not use products in a chemical atmosphere such as
chlorine gas, acid or sulfide gas.
Do not use products in the environment close to the
organic solvent.
<Storage and Handling Requirements>
1. Storage Period
2. Storage Conditions
1. About the Rated Current
2. About the Excessive Surge Current
(1) Storage temperature: -10 to +40˚C
(2) Do not store products in a chemical atmosphere
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Storage and Operating Conditions
Failure and degradation of a product are caused
by the cleaning method. When you clean in conditions
that are not in mounting information, please contact
Murata engineering.
Reliability decreases with improper soldering methods.
Please solder by the standard soldering conditions
shown in mounting information.
Noise suppression levels resulting from Murata's EMI
suppression filters EMIFILr may vary, depending on
the circuits and ICs used, type of noise, mounting
pattern, mounting location, and other operating
conditions. Be sure to check and confirm in advance
the noise suppression effect of each filter, in actual
circuits, etc. before applying the filter in a commercial-
purpose equipment design.
BLM15E/15H/15G series should be used within 12
months, the other series should be used within 6
months.
Solderability should be checked if this period is
exceeded.
Notice (Soldering and Mounting)
Rating
Do not use products beyond the rated current as this
may create excessive heat and deteriorate the
insulation resistance.
Excessive surge current ( pulse current or rush
current) than specified rated current applied to the
product may cause a critical failure, such as an open
circuit, burnout caused by excessive temperature
rise. Please contact us in advance in case of
applying the surge current.
Relative humidity: 15 to 85%
Avoid sudden changes in temperature and humidity.
such as chlorine gas, acid or sulfide gas.
!Caution/Notice
!Caution
Notice
1. Resin Coating
2. Handling of a Substrate
• Self-heating
Bending
Please provide special attention when mounting chip
ferrite beads BLM_AX/P/K/S series in close proximity
to other products that radiate heat.
The heat generated by other products may deteriorate
the insulation resistance and cause excessive heat in
this component.
Handling
Using resin for coating/molding products may affect
the products performance.
So please pay careful attention in selecting resin.
Prior to use, please make the reliability evaluation with
the product mounted in your application set.
After mounting products on a substrate, do not apply
any stress to the product caused by bending or
twisting to the substrate when cropping the substrate,
inserting and removing a connector from the substrate
or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in
the Product.
Soldering and Mounting
Twisting
Mar.28,2011
C31E.pdf