GCM1885G1H150JA16D Murata Electronics North America, GCM1885G1H150JA16D Datasheet - Page 32

• Manufacturer Part Number: GCM1885G1H150JA16D
• Description: CAP CER 15PF 50V X8G SMD
• Manufacturer: Murata Electronics North America
• Series: GCMr

Specifications of GCM1885G1H150JA16D

• Voltage - Rated: 50V
• Lead Style: *
• Capacitance: 15pF
• Tolerance: ±5%
• Temperature Coefficient: X8G
• Mounting Type: *
• Operating Temperature: -55°C ~ 150°C
• Applications: Automotive
• Ratings: AEC-Q200
• Package / Case: *
• Size / Dimension: *
• Thickness: *
• Lead Spacing: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

1
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
4-3. Correction with a Soldering Iron
1. When sudden heat is applied to the components when
2. After soldering, do not allow the component/PCB to
3. The operating time for the re-working should be as short
4. Optimum Solder amount when re-working with a
4-4. Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as
5. Washing
Excessive ultrasonic oscillation during cleaning can cause
the PCBs to resonate, resulting in cracked chips or broken
solder joints. Take note not to vibrate PCBs.
30
!Caution
!Caution (Soldering and Mounting)
using a soldering iron, the mechanical strength of the
components will decrease because the extreme
temperature change can cause deformations inside the
components. In order to prevent mechanical damage to
the components, preheating is required for both the
components and the PCB board. Preheating conditions,
(The "Temperature of the Soldering Iron Tip", "Preheating
Temperature", "Temperature Differential" between the
iron tip and the components and the PCB), should be
within the conditions of table 3. It is required to keep the
temperature differential between the soldering iron and
the component surfaces ( T) as small as possible.
rapidly cool down.
as possible. When re-working time is too long, it may
cause solder leaching, and that will cause a reduction in
the adhesive strength of the terminations.
Soldering lron
4-1. In case of sizes smaller than 0603, (GCM03/15/18),
4-2. A soldering iron with a tip of ø3mm or smaller should
4-3. Solder wire with ø0.5mm or smaller is required for
transformers and ICs) are being mounted, chips may
crack and solder joints may break.
Before mounting leaded components, support the PCB
using backup pins or special jigs to prevent warping.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
the top of the solder fillet should be lower than 2/3's
of the thickness of the component or 0.5mm
whichever is smaller. In case of 0805 and larger
sizes, (GCM21/31/32), the top of the solder fillet
should be lower than 2/3's of the thickness of the
component. If the solder amount is excessive, the
risk of cracking is higher during board bending or
under any other stressful condition.
be used. It is also necessary to keep the soldering
iron from touching the components during the
re-work.
soldering.
Table 3
GCM03/15/18/21/31
GCM32
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Part Number
350 C max.
280 C max.
Temperature
of Soldering
Iron Tip
Temperature
150 C min.
150 C min.
Preheating
Continued on the following page.
Temperature
Differential
TV190 C
TV130 C
Solder Amount
( T)
in section
Atmosphere
Air
Air
C03E.pdf
10.5.20