GCM1885G1H820JA16D Murata Electronics North America, GCM1885G1H820JA16D Datasheet - Page 38

• Manufacturer Part Number: GCM1885G1H820JA16D
• Description: CAP CER 82PF 50V X8G SMD
• Manufacturer: Murata Electronics North America
• Series: GCMr

Specifications of GCM1885G1H820JA16D

• Voltage - Rated: 50V
• Lead Style: *
• Capacitance: 82pF
• Tolerance: ±5%
• Temperature Coefficient: X8G
• Mounting Type: *
• Operating Temperature: -55°C ~ 150°C
• Applications: Automotive
• Ratings: AEC-Q200
• Package / Case: *
• Size / Dimension: *
• Thickness: *
• Lead Spacing: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

1
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
2. Land Dimensions
Table 1 Flow Soldering Method
Table 2 Reflow Soldering Method
2. Adhesive Application
1. Thin or insufficient adhesive can cause the chips to
2. Low viscosity adhesive can cause chips to slip after
3. Adhesive Coverage
3. Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to
36
Notice
Notice (Soldering and Mounting)
Part Number
Part Number
2-1. Chip capacitor can be cracked due to the stress of
loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c,
shown in the drawing at right, to obtain the correct
bonding strength.
The chip's electrode thickness and land thickness must
also be taken into consideration.
mounting. The adhesive must have a viscosity of
5000Pa
disconnect during flow soldering and causes deterioration
in the insulation resistance between the outer electrodes
due to moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
Continued from the preceding page.
GCM18
GCM21
GCM31
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
PCB bending / etc if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
GCM18
GCM21
GCM31
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
Part Number
•
s (500ps) min. (at 25 C).
Dimensions
Dimensions
Chip (LgW)
Chip (LgW)
2.0g1.25
2.0g1.25
1.6g0.8
3.2g1.6
0.6g0.3
1.0g0.5
1.6g0.8
3.2g1.6
3.2g2.5
Adhesive Coverage*
0.05mg min.
0.15mg min.
0.1mg min.
*Nominal Value
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.2 to 0.3
0.3 to 0.5
0.6 to 0.8
1.0 to 1.2
2.2 to 2.4
2.0 to 2.4
a
a
Board
0.35 to 0.45
c
0.2 to 0.35
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.6 to 0.7
0.6 to 0.7
0.8 to 0.9
1.0 to 1.2
b
Chip Capacitor
b
b
Chip Capacitor
Land
a
Adhesive
Continued on the following page.
Solder Resist
Land
a=20 to 70 m
b=30 to 35 m
c=50 to 105 m
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
0.2 to 0.4
0.4 to 0.6
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
1.8 to 2.3
a
b
c
c
c
(in mm)
(in mm)
C03E.pdf
10.5.20