GRM32ER61C476KE15L Murata Electronics North America, GRM32ER61C476KE15L Datasheet - Page 148

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GRM32ER61C476KE15L

Manufacturer Part Number
GRM32ER61C476KE15L
Description
CAP CER X5R 1210
Manufacturer
Murata Electronics North America
Series
GRMr
Datasheet

Specifications of GRM32ER61C476KE15L

Voltage - Rated
16V
Lead Style
*
Capacitance
47µF
Tolerance
±10%
Temperature Coefficient
X5R
Mounting Type
*
Operating Temperature
-55°C ~ 85°C
Applications
General Purpose
Package / Case
*
Size / Dimension
*
Thickness
*
Lead Spacing
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
GRM32ER61C476KE15L
Manufacturer:
Murata
Quantity:
600 000
Part Number:
GRM32ER61C476KE15L
Manufacturer:
MURATA/村田
Quantity:
20 000
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
2. Land Dimensions
Table 1 Flow Soldering Method
Table 2 Reflow Soldering Method
146
Notice
Notice
Part Number
Part Number
2-1. A chip capacitor can be cracked due to the stress of
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
PCB bending / etc if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering, table 3 for
GNM & LLA, and table 4 for LLM.
Please confirm the suitable land dimension by
evaluating the actual SET / PCB.
GRM18
GQM18
GRM21
GQM21
GRM31
GRM02
GRM03
GRM15
GRM18
GQM18
GRM21
GQM21
GRM31
GRM32
GRM43
GRM55
GQM22
GJM03
GJM15
LLR18
LLL21
LLL31
LLL15
LLL18
LLL21
LLL31
Dimensions
Dimensions
Chip (LgW)
Chip (LgW)
2.0g1.25
1.25g2.0
2.0g1.25
1.25g2.0
0.4g0.2
1.6g0.8
3.2g1.6
1.6g3.2
0.6g0.3
1.0g0.5
1.6g0.8
3.2g1.6
3.2g2.5
4.5g3.2
5.7g5.0
0.5g1.0
0.8g1.6
1.6g3.2
3.2g2.5
0.16 to 0.2
0.15 to 0.2
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.4 to 0.7
0.6 to 1.0
0.2 to 0.3
0.3 to 0.5
0.6 to 0.8
1.0 to 1.2
2.2 to 2.4
2.0 to 2.4
3.0 to 3.5
4.0 to 4.6
0.2 to 0.3
0.4 to 0.6
0.6 to 0.8
2.2 to 2.5
a
a
0.12 to 0.18
0.35 to 0.45
0.2 to 0.35
0.2 to 0.25
c
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.5 to 0.7
0.8 to 0.9
0.6 to 0.7
0.6 to 0.7
0.8 to 0.9
1.0 to 1.2
1.2 to 1.4
1.4 to 1.6
0.3 to 0.4
0.4 to 0.5
0.6 to 0.7
0.8 to 1.0
b
Chip Capacitor
b
b
a
Continued on the following page.
Solder Resist
Land
0.2 to 0.23
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
1.4 to 1.8
2.6 to 2.8
0.2 to 0.4
0.4 to 0.6
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
1.8 to 2.3
2.3 to 3.0
3.5 to 4.8
0.7 to 1.0
1.4 to 1.6
1.4 to 1.8
2.6 to 2.8
1.9 to 2.3
c
c
(in mm)
(in mm)
C02E.pdf
10.12.20

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