STM8L152K4U6 STMicroelectronics, STM8L152K4U6 Datasheet - Page 114

• Manufacturer Part Number: STM8L152K4U6
• Description: MCU 8BIT 16KB FLASH 32UFQFPN
• Manufacturer: STMicroelectronics
• Series: STM8L EnergyLiter

Specifications of STM8L152K4U6

• Featured Product: STM32 Cortex-M3 Companion Products
• Core Processor: STM8
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: I²C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, IR, LCD, POR, PWM, WDT
• Number Of I /o: 29
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 21x12b, D/A 1x12
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-
4. Dimensions are in millimeters.
Package characteristics
Table 64.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
114/122
Figure 45. UFQFPN32 - 32-lead ultra thin fine pitch
side pad to PCB ground.
Dim.
ddd
D2
A1
A3
E2
A
D
E
N
b
e
L
Seating plane
Pin # 1 ID
R = 0.30
C
E2
A3
UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package (5 x 5),
quad flat no-lead package outline
(5 x 5)
package mechanical data
b
8
1
32
9
0.00
0.18
4.90
4.90
3.40
0.30
Min
0.5
(1)(2)(3)
e
Bottom view
D2
D
16
0.152
0.500
L
0.55
0.02
0.23
5.00
3.50
5.00
3.50
0.40
0.08
mm
Typ
17
24
L
A1
E
A
Doc ID 15962 Rev 6
ddd C
A0B8_ME
Max
0.05
0.28
5.10
5.10
3.60
0.50
0.6
Number of pins
32
Figure 46. UFQFPN32 recommended
0.0197
0.0071
0.1929
0.1929
0.1339
0.0118
Min
0
footprint
STM8L151xx, STM8L152xx
inches
0.0217
0.0008
0.0091
0.1969
0.1378
0.1969
0.1378
0.0197
0.0157
0.0031
0.006
Typ
(1)(4)
(1)
0.0110
0.0236
0.0020
0.2008
0.2008
0.1417
0.0197
Max