LRF1206-R015FW TT Electronics/Welwyn, LRF1206-R015FW Datasheet - Page 2

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LRF1206-R015FW

Manufacturer Part Number
LRF1206-R015FW
Description
RES 0.015 OHM 1/2W 1206 1% SMD
Manufacturer
TT Electronics/Welwyn
Series
LRFr
Datasheet

Specifications of LRF1206-R015FW

Resistance (ohms)
0.015
Number Of Terminations
2
Package / Case
1206 (3216 Metric)
Power (watts)
0.5W, 1/2W
Composition
Ceramic
Features
Current Sense
Tolerance
±1%
Size / Dimension
0.126" L x 0.064" W (3.20mm x 1.63mm)
Height
0.031" (0.80mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Temperature Coefficient
-
Other names
985-1184-2
Packing
Ordering Procedure
Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces
Type
Mounting
Size
Value (use IEC62 code)
Tolerance (use IEC62 code)
Low Value Flat
Chip Resistor
LRC/LRF Series
Note:
1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic
chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue.
2. Full AEC-Q200 qualification applies to ohmic values
© Welwyn Components Limited
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
ref
14
15 Resistance to Soldering Heat MIL-STD-202 Method 210
16
18
21
22
3
4
6
7
8 Operational Life (Cyclic Load) MIL-STD-202 Method 108
F
G
J
F
Dimensions (mm)
LR1206
LR2010
LR2512
T1
W
1%
2%
5%
Conventional (element up)
Flip-chip (element down)
AEC-Q200 Table 7
Low Temperature Storage
Tape
High Temp. Exposure MIL-STD-202 Method 108
Short Term Overload
Temperature Cycling
Moisture Resistance MIL-STD-202 Method 106
Terminal Strength
Test
Leach Resistance
Biased Humidity MIL-STD-202 Method 103
1206 or 2010
2512
All sizes
Thermal Shock MIL-STD-202 Method 107
Solderability
Board Flex
Vibration MIL-STD-202 Method 204
Bedlington, Northumberland NE22 7AA, UK
JESD22 Method JA-104
3000/reel
1800/reel
1000/reel
-65°C for 100 hours
Solder dip at 250°C
Values > R025
AEC-Q200-005
AEC-Q200-006
6.25 x Pr for 2s
Values < R025
3.05
2.0
3.7
A
J-STD-002
Method
Standard
7.75
4.0
6.5
B
>95% coverage
R01.
R% 0.5
R% 0.25 0.1
R% 0.5
R% 0.5
R%
R% 0.5 0.05
R% 0.25 0.05
R% 0.25 0.1
R% 0.5
R% 0.25 0.1
R% 0.5
R% 0.5
(add R05)
90s minimum
Max.
L R F 2 5 1 2 – R 0 1 G W
1
(@1R0)
Typ.
0.2
0.2
0.2
0.5
0.2
1.25
1.5
1.5
C
100
(%)
80
40
20
60
0
25
Welwyn Components
Ambient temperature
B
70
A
C
150 (°C)
04.10

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