PHP01206E1000BST5 Vishay, PHP01206E1000BST5 Datasheet - Page 2

• Manufacturer Part Number: PHP01206E1000BST5
• Description: RES 100 OHM 1W .1% 1206
• Manufacturer: Vishay
• Series: PHPr

Specifications of PHP01206E1000BST5

• Resistance (ohms): 100
• Number Of Terminations: 2
• Package / Case: 1206 (3216 Metric)
• Power (watts): 1W
• Composition: Thin Film
• Features: Flame Proof
• Temperature Coefficient: ±25ppm/°C
• Tolerance: ±0.1%
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Height: 0.033" (0.84mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: PHP100ATR

PHP
Vishay Thin Film
Notes
• Chip surface temperature measured using FLIR A40 thermal
• Thermal imaging was conducted under ambient conditions
• Thermal imaging and load life testing was conducted mounting
www.vishay.com
80
DIMENSIONS in inches
CASE SIZE
1206
2512
LAND PATTERN DIMENSIONS in inches
STANDARD MATERIAL SPECIFICATIONS
Resistive Element
Substrate Material
Terminations (Tin/Lead)
Terminations (Lead (Pb)-free)
PHP CHIP TEMP. VS. APPLIED POWER
imaging system with an approximate test card surface
temperature of 85 °C.
resulting in a steady state test card surface temperature of 85 °C
over the full range of power levels.
one device to 2" x 3" test cards with 2.5 mil copper plating on
both surfaces. Thermal vias on 120 mil centers were utilized for
heat transfer between surfaces of the test card.
5.00
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
0.259 + 0.009/- 0.015
1206 - 100 Ω
1206 - 5 kΩ
1206 - 10 kΩ
Chip Surface Temperature (°C)
70
0.126 ± 0.008
PHP Land Pattern for 1206 Case Size
LENGTH
0.0710
150
High Power Thin Film Wraparound Chip Resistor
0.0755
0.0220
For technical questions, contact:
200
W (± 0.005)
T
WIDTH
0.063
0.124
Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier
L
E
THICKNESS
0.015/0.033
0.015/0.033
Notes
• Chip surface temperature measured using FLIR A40 thermal
MIN./MAX.
Tin/lead solder over nickel barrier
PHP CHIP TEMP. VS. APPLIED POWER
[e-mail]
imaging system with an approximate test card surface
temperature of 85 °C.
0.1260
Temperature
PHP Land Pattern for 2512 Case Size
Resistance
W
Case Size
D
Value
150
200
70
Alumina (Al
10.00
9.00
8.00
7.00
6.00
5.00
4.00
3.00
2.00
1.00
0.00
Nichrome
0.0910
0.020 + 0.005/- 0.010
2
Up to 10 
2512 - 10 Ω
2512 - 10 kΩ
2512 - 30 kΩ
Chip Surface Temperature (°C)
O
70
3
0.1090
D (± 0.005)
2512
2.44
6.82
9.33
TOP PAD
)
0.02
150
Up to 10 k
Power (W)
Document Number: 60076
2512
1.81
4.89
6.63
Revision: 24-Feb-11
BOTTOM PAD
E (± 0.005)
200
0.040
0.050
Up to 30 k
2512
1.87
5.19
7.09