GRM155R71H332KA01D Murata, GRM155R71H332KA01D Datasheet - Page 147

Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 0402 3300pF 50volts X7R 10%

GRM155R71H332KA01D

Manufacturer Part Number
GRM155R71H332KA01D
Description
Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 0402 3300pF 50volts X7R 10%
Manufacturer
Murata
Series
GRMr
Datasheet

Specifications of GRM155R71H332KA01D

Voltage Rating
50 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
General Type MLCCs
Dimensions
0.5 mm W x 1 mm L x 0.5 mm H
Termination Style
SMD/SMT
Capacitance
3300 pF
Tolerance
10 %
Package / Case
0402 (1005 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
GRM155R71H332KA01D
Manufacturer:
MURATA
Quantity:
640 000
Part Number:
GRM155R71H332KA01D
Manufacturer:
MURATA
Quantity:
110 000
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. PCB Design
1. Notice for Pattern Forms
Pattern Forms
and Leaded Components
Placing Close to Chassis
of Leaded Components
Notice
after Chip Component
of Chip Components
1-1. Unlike leaded components, chip components are
1-2. It is possible for the chip to crack by the expansion
Soldering and Mounting
Lateral Mounting
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
susceptible to flexing stresses since they are
mounted directly on the substrate.
They are also more sensitive to mechanical and
thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses
and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration
to eliminate the possibility of excess solder fillet
height.
and shrinkage of a metal board. Please contact us if
you want to use our ceramic capacitors on a metal
board such as Aluminum.
Placing
Placing
Electrode Pattern
Lead Wire
Solder (ground)
Prohibited
Chassis
Soldering Iron
Lead Wire
Solder Resist
Solder Resist
Solder Resist
Correct
Solder Resist
Continued on the following page.
Notice
145
C02E.pdf
10.12.20

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