AS2536 austriamicrosystems, AS2536 Datasheet - Page 22

• Manufacturer Part Number: AS2536
• Description: IC MULTI-STANDARD CMOS TELEPHONE SOIC-28
• Manufacturer: austriamicrosystems

Specifications of AS2536

• Audio Control Type: Volume
• Control / Process Application: Electronic Telephonic Set
• Supply Voltage Range: 3.8V To 5V
• Operating Temperature Range: -25°C To +70°C
• Audio Ic Case Style: SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Data Sheet AS2533-36
Vertical Structure of Bond Pads
Process CXQ/CXB – FAB B
Revision 8.8
General Conditions
Passivation
Marking of Failure Dice
Allowed Loss after Assembly
Quantity of dice per delivery lot Only complete wafers can be delivered, therefore the number of good dice delivered may
Storage Conditions
Conditions for Delivery as Wafer
Wafer diameter
Wafer thickness
Back finishing
Scribe lane width
Packing
Max. Storage time in sealed
box
200 nm silicon oxynitride + 550 nm silicon nitride
Ink Dots, water resistant, Diameter 0.4...1.2 mm
< 5% in average
< 10% for a single delivery lot
Compensation is limited to replacement of the number of defectives exceeding the above
allowances.
differ from the order quantity up to ±1000 pcs.
Dice on wafer or dice on foil must be stored in originally sealed boxes or bags.
For storage period - see below.
200 mm
380 ± 20µm
back grinding, silicon
100 ± 20µm
Wafer Box Ultrapack 200 / sealed in foil bags
6 month, Tamb = 25° C
Except for RMA, opened boxes or bags will not be accepted by austriamicrosystems for return
metal 2
metal 1
metal 1 barrier
polysilicon
oxide
Si
substrate
Layer Specification
metal 2
metal 1
metal 1 barrier
polysilicon
oxide
silicon substrate
upper layer:
lower layer:
upper layer:
lower layer:
upper layer
lower layer
austriamicrosystems
460 nm thermal oxide
270 nm polysilicon
960 nm AISiCu
98.5% Aluminium
1.0% Silicon
0.5 % Copper
40 nm Titanium
450 nm AISiCu
98.5 % Aluminium
1.0% Silicon
0.5 % Copper
40 nm Titanium
80nm Titanium Nitride
30nm Titanium
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