LTC2383CMS-16#PBF Linear Technology, LTC2383CMS-16#PBF Datasheet - Page 23

• Manufacturer Part Number: LTC2383CMS-16#PBF
• Description: IC, ADC, 16BIT, 1MSPS, Serial-SPI, MSOP16
• Manufacturer: Linear Technology

Specifications of LTC2383CMS-16#PBF

• Resolution (bits): 16bit
• Sampling Rate: 1MSPS
• Input Channel Type: Differential
• Data Interface: Serial, SPI
• Supply Voltage Range - Analog: 2.375V To 2.625V
• Supply Current: 5.2mA
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGE DESCRIPTION
3.60 ±0.05
(.0120 .0015)
0.305 0.038
2.20 ±0.05
TYP
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
(.206)
5.23
MIN
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
1.70 ± 0.05
3.30 ±0.05
3.15 REF
(.0197)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation
that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50
BSC
0.889 0.127
(.035 .005)
(.126 – .136)
3.20 – 3.45
0.45 BSC
0.25 ± 0.05
0.70 ±0.05
PACKAGE
OUTLINE
(SEE NOTE 6)
GAUGE PLANE
TOP MARK
(.007)
0.18
(Reference LTC DWG # 05-08-1732 Rev Ø)
(Reference LTC DWG # 05-08-1669 Rev Ø)
16-Lead Plastic DFN (4mm × 3mm)
PIN 1
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
PACKAGE OUTLINE MO-229
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
16-Lead Plastic MSOP
(.010)
0.254
MS Package
DE Package
4.00 ±0.10
(2 SIDES)
DETAIL “A”
DETAIL “A”
0 – 6 TYP
(.021 .006)
0.53 0.152
SEATING
PLANE
3.00 ±0.10
0.75 ±0.05
(2 SIDES)
0.00 – 0.05
R = 0.05
(.007 – .011)
0.17 – 0.27
(.193 .006)
4.90 0.152
TYP
TYP
(.043)
MAX
1.10
8
BOTTOM VIEW—EXPOSED PAD
9
1.70 ± 0.10
(.0197)
0.50
BSC
16151413121110
1 2 3 4 5 6 7 8
4.039 0.102
(.159 .004)
(NOTE 3)
R = 0.115
3.30 ±0.10
3.15 REF
LTC2383-16
TYP
9
(.118 .004)
3.00 0.102
0.45 BSC
(NOTE 4)
0.23 ± 0.05
0.280 0.076
16
(.011 .003)
MSOP (MS16) 1107 REV Ø
(.034)
0.86
0.40 ± 0.10
1
REF
0.1016 0.0508
(.004 .002)
REF
(DE16) DFN 0806 REV Ø
PIN 1 NOTCH
R = 0.20 OR
0.35 45°
CHAMFER
23
238316f