NTCS0603E3272JMT Vishay, NTCS0603E3272JMT Datasheet - Page 6

• Manufacturer Part Number: NTCS0603E3272JMT
• Description: THERMISTOR NTC 2.7K 5% 0603
• Manufacturer: Vishay
• Type: NTCr

Specifications of NTCS0603E3272JMT

• Resistance In Ohms @ 25°c: 2.7K
• Resistance Tolerance: ±5%
• B Value Tolerance: ±1%
• B25/85: 3600K
• Operating Temperature: -40°C ~ 150°C
• Power - Max: 125mW
• Mounting Type: Surface Mount
• Package / Case: 0603 (1608 Metric)
• Description Of Terminals: Leadless
• Mounting Style: Surface Mount
• Pin Count: 2
• Screening Level: Automotive
• Sensitivity Index: 3600K
• Resistance @ 25c: 2.7kohm
• Thermal Time Constant: 8s
• Percentage Of Resistance Tolerance @ 25c: ±5
• Accuracy: ±1
• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 150C
• Product Length (mm): 1.6mm
• Product Height (mm): 0.8mm
• Product Depth (mm): 0.8mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• B0/50: -
• B25/50: -
• B25/75: -
• B25/100: -
• Lead Length: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: BC2484TR

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NTCS0603E3.....T/2381 615 3....
Vishay BCcomponents
SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum
temperature of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
TESTS AND REQUIREMENTS
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with
PAPER TAPE
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
300
250
200
150
100
50
0
6
D 0
0
≈ 245 °C
260 °C
215 °C
180 °C
130 °C
A 0
50
B 0
P 1
P 2
Reflow Soldering
TEST METHOD
2 K/s
P 0
100
T
C
Time (s)
150
For technical questions, contact:
10 s
10 s
40 s
1.0
Resistance to soldering heat
F
E 1
SMD 0603, Glass Protected
“IEC 60286-3”
200
W
Solderability
0.8
NTC Thermistors
Dimensions of the solder lands
TEST
T 1
T
250
. Basic dimensions are given below. Carrier tape material is paper.
2.4
Notes
(1)
(2)
DIMENSIONS OF PAPER TAPE in millimeters
PARAMETER
A
B
W
E
F
D
P
P
P
T tape thickness
T
Measured 0.3 mm above base pocket
P
1
0
0
1
0
1
2
0
0
[e-mail]
(1)
(1)
(2)
cover tape
300
250
200
150
100
pitch cumulative error over any 10 pitches ± 0.2 mm
50
0
0
PROCEDURE
10 s at 260 °C
Lead (Pb)-free Reflow Soldering Profile
2 s at 235 °C
≈ 245 °C
≈ 170 °C
235 °C
260 °C
50
100
2 K/s
max.
≈ 120 °C
DIMENSION
150
Time (s)
< 0.1
1.15
1.75
1.55
1.9
8.0
3.5
4.0
4.0
2.0
1.1
Min. 95 % of surface wetted
200
REQUIREMENTS
Document Number: 29056
ΔR/R < 5 %
250
20 s min.
40 s max.
Revision: 25-May-10
≈ 60 s
TOLERANCE
6 K/s
max.
limit
normal
300
± 0.05
± 0.05
± 0.05
± 0.1
± 0.1
± 0.2
± 0.1
± 0.1
± 0.1
max.
-
350