SNAP-ODC-32-SNK-FM OPTO 22, SNAP-ODC-32-SNK-FM Datasheet - Page 2

• Manufacturer Part Number: SNAP-ODC-32-SNK-FM
• Description: SNAP 32-channel High-Density Digital Output Module, 5-60 VDC Load Sinking-FM Approved
• Manufacturer: OPTO 22

Specifications of SNAP-ODC-32-SNK-FM

• Voltage Rating: 24VDC
• Current Rating: 150mA
• Length: 82.8mm
• External Width: 82.55mm
• External Depth: 18.29mm
• Accessory Type: Digital Output Module

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All HDD input modules feature automatic counting and
latching. DC models are ideal for detecting low-voltage
auxiliary contacts.
Mounting Racks
SNAP high-density digital modules are designed to work with
SNAP PAC mounting racks. Up to 16 modules can be mounted
on a rack, making up to 512 digital points available. In
addition, HDD modules can be mixed with 4-channel SNAP
digital, analog, and serial modules on the same rack.
SNAP racks use a retention rail locking system that holds
modules securely to the rack. Normally, a hold-down screw is
not required. However, for applications that require additional
module security, each module has provisions for two 4-40 by
½-inch standard machine screws to hold each module in
position on the SNAP rack.
Wiring Aids: Breakout Boards, Wiring
Harnesses, and Header Cables
Due to space constraints, instead of using the usual removable
terminal connectors, high-density digital modules use other
wiring devices. These cables and breakout boards are available
separately and are detailed in form 1756, the SNAP TEX Cables
and Breakout Boards Data Sheet, available on our website.
SNAP breakout boards for high-density digital modules
provide LED indicators as well as labeled and easily accessible
fused connectors for input or output points, all of which
simplify connecting field devices to HDD modules.
For a table showing compatible boards, cables, and modules,
see the SNAP TEX Cables and Breakout Boards Data Sheet.
If you are not using breakout boards, you can connect 16-
point input modules directly to field devices or terminal strips
using the SNAP-HD-ACF6 wiring harness assembly. The
assembly includes two 8-point connectors that plug securely
into the top of the module and provide flying leads at the field
end.
Similarly, 32-point modules can connect to field devices with
the SNAP-HD-CBF6 wiring harness, which plugs into the top
of the module and provides flying leads.
Opto 22 • 43044 Business Park Drive • Temecula, CA 92590-3614 • www.opto22.com
SALES 800-321-6786 • 951-695-3000 • FAX [phone] • [e-mail] • SUPPORT 800-835-6786 • 951-695-3080 • FAX [phone] • [e-mail]
© 2006–2011 Opto 22. All rights reserved. Dimensions and specifications are subject to change. Brand or product names used herein are trademarks or registered trademarks of their respective companies or organizations.
SNAP-IDC-HDB breakout board
SNAP High-Density Digital I/O Modules
G4 Digital I/O Connectivity
SNAP-ODC-32-SNK digital output modules can connect to
G4PB16 mounting racks using the SNAP-HD-G4F6 header
cable to integrate older G4 digital output I/O systems with
modern PAC Project software and SNAP Ethernet-based
controllers. This connection makes available the G4 I/O’s 3-
amp switching capability, which provides twelve times the
0.25 amp capability per point of the high-density digital
modules themselves.
SNAP Product Compatibility
SNAP HDD modules are compatible with the SNAP PAC
System and can be used on SNAP PAC mounting racks with
SNAP PAC R-series controllers and SNAP PAC EB and SB brains.
These modules can be used with both standard wired
Ethernet controllers and brains and with Wired+Wireless
models.
Other digital, analog, and serial SNAP I/O modules can be
placed on the same rack with HDD modules for the mix of
signals required at any location.
NOTE: For information on using HDD modules in older
systems, see form #1688, the SNAP PAC System Migration
Technical Note.
Programming
Opto 22 PAC Control software version 8.0 or newer is required
if you are using SNAP high-density digital modules with a
SNAP PAC controller. SNAP HDD modules can also be accessed
by custom software built with the OptoMMP Communication
Toolkit or by communication with an EtherNet/IP or Modbus/
TCP system.
See Opto 22 form 1547, the SNAP High-Density Digital Modules
User’ s Guide, for detailed information on using these modules
in a PAC Control strategy. The OptoMMP Communication
Toolkit is documented in Opto 22 form 1465, the OptoMMP
Protocol Guide. Communication with A-B PLC systems is
covered in form 1770, the EtherNet/IP for SNAP PAC Protocol
Guide. For Modbus/TCP systems, see form 1678, the Modbus/
TCP Protocol Guide.
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