ADS930MC Murata Power Solutions Inc, ADS930MC Datasheet - Page 6

• Manufacturer Part Number: ADS930MC
• Description: Analog To Digital Converter
• Manufacturer: Murata Power Solutions Inc

DATEL
Gain Adjust Procedure
1. Apply +4.999771V to the ANALOG INPUT (pin 3) for bipolar gain adjust or
2. For a unipolar input - adjust the gain potentiometer until all output bits are
3. Two's complement coding requires using pin 40. With pin 8 tied high,
For a bipolar input - adjust the gain potentiometer until all output bits are
apply –9.999771V to pin 3 for unipolar gain adjust.
1's and the LSB fl ickers between a 1 and 0 with pin 8 tied high (straight
binary) or until all output bits are 0's and the LSB fl ickers between a 1 and
0 with pin 8 tied low (complementary binary).
1's and the LSB fl ickers between a 1 and 0 with pin 8 tied low (comple-
mentary offset binary) or until all output bits are 0's and the LSB fl ickers
between a 1 and 0 ith pin 8 tied high (offset binary).
adjust the gain trimpot until the output code fl ickers equally between 1000
0000 0000 0000 and 1000 0000 0000 0001.
®
INTERNAL S/H
CONVERT
OUTPUT
START
DATA
EOC
Note: Scale is approximately 50ns per division.
N
®
10ns min., 25ns max.
• 11 Cabot Boulevard, Mansfi eld, MA 02048-1151 USA • Tel: [phone] • www.datel.com • e-mail: [e-mail]
175ns min., 200ns typ., 215ns max .
780ns ±30ns
Data N-1 Valid
Figure 3. ADS-930 Timing Diagram
Figure 4. FFT Analysis of ADS-930
Hold 1.54—s typ.
1.39—s min.
THERMAL REQUIREMENTS
All DATEL sampling A/D converters are fully characterized and specifi ed over
operating temperature (case) ranges of 0 to +70°C and –55 to +125°C. All
room-temperature (TA = +25°C) production testing is performed without the
use of heat sinks or forced-air cooling. Thermal impedance fi gures for each
device are listed in their respective specifi cation tables.
These devices do not normally require heat sinks, however, standard precau-
tionary design and layout procedures should be used to ensure devices do
not overheat. The ground and power planes beneath the package, as well as
all pcb signal runs to and from the device, should be as heavy as possible to
help conduct heat away from the package. Electrically insulating, thermally
conductive "pads" may be installed underneath the package. Devices should
be soldered to boards rather than "socketed", and of course, minimal air fl ow
over the surface can greatly help reduce the package temperature.
Conversion Time
700ns ±30ns
16-Bit, 500kHz Sampling A/D Converters
460ns typ. 545ns max.
Invalid
Acquisition Time
Data
140ns max.
30ns min .
Data N Valid
01 Apr 2011 MDA_ADS-930.B02 Page 6 of 8
N+1
10ns min.
25ns max.
ADS-930