IRF9630PBF Vishay, IRF9630PBF Datasheet - Page 2

P CH MOSFET, -200V, 6.5A, TO-220

IRF9630PBF

Manufacturer Part Number
IRF9630PBF
Description
P CH MOSFET, -200V, 6.5A, TO-220
Manufacturer
Vishay
Type
Power MOSFETr
Datasheets

Specifications of IRF9630PBF

Transistor Polarity
P Channel
Continuous Drain Current Id
-6.5A
Drain Source Voltage Vds
-200V
On Resistance Rds(on)
800mohm
Rds(on) Test Voltage Vgs
-10V
Threshold Voltage Vgs Typ
-4V
Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
800 mOhm @ 3.9A, 10V
Drain To Source Voltage (vdss)
200V
Current - Continuous Drain (id) @ 25° C
6.5A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
29nC @ 10V
Input Capacitance (ciss) @ Vds
700pF @ 25V
Power - Max
74W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Minimum Operating Temperature
- 55 C
Configuration
Single
Resistance Drain-source Rds (on)
0.8 Ohm @ 10 V
Drain-source Breakdown Voltage
200 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
6.5 A
Power Dissipation
74000 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Number Of Elements
1
Polarity
P
Channel Mode
Enhancement
Drain-source On-res
0.8Ohm
Drain-source On-volt
200V
Gate-source Voltage (max)
±20V
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Through Hole
Pin Count
3 +Tab
Package Type
TO-220AB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
*IRF9630PBF

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IRF9630, SiHF9630
Vishay Siliconix
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %.
www.vishay.com
2
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient
Case-to-Sink, Flat, Greased Surface
Maximum Junction-to-Case (Drain)
SPECIFICATIONS (T
PARAMETER
Static
Drain-Source Breakdown Voltage
V
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
DS
Temperature Coefficient
J
= 25 °C, unless otherwise noted)
a
This datasheet is subject to change without notice.
SYMBOL
SYMBOL
ΔV
R
V
R
t
t
R
R
C
I
I
C
C
V
GS(th)
DS(on)
Q
Q
V
d(on)
d(off)
I
GSS
DSS
g
Q
Q
DS
L
L
t
SM
I
t
thCS
thJC
t
t
thJA
DS
oss
SD
on
rss
S
iss
gd
rr
fs
gs
r
f
D
S
g
rr
/T
J
T
Between lead,
6 mm (0.25") from
package and center of
die contact
MOSFET symbol
showing the
integral reverse
p - n junction diode
V
V
J
V
GS
GS
= 25 °C, I
DS
T
R
Intrinsic turn-on time is negligible (turn-on is dominated by L
J
Reference to 25 °C, I
g
= - 10 V
= - 10 V
= - 160 V, V
= 25 °C, I
= 12 Ω, R
V
V
V
V
V
DD
DS
f = 1.0 MHz, see fig. 5
DS
TYP.
DS
GS
0.50
TEST CONDITIONS
= - 100 V, I
-
-
= - 50 V, I
F
= V
= - 200 V, V
= 0 V, I
= - 6.5 A, dI/dt = 100 A/μs
V
V
V
GS
DS
S
GS
D
GS
= - 6.5 A, V
GS
= 15 Ω, see fig. 10
, I
= - 25 V,
= ± 20 V
= 0 V,
D
D
see fig. 6 and 13
= 0 V, T
= - 250 μA
D
= - 250 μA
V
D
I
= - 3.9 A
I
DS
D
D
GS
= - 6.5 A,
D
= - 3.9 A
= - 6.5 A,
= - 160 V,
= 0 V
= - 1 mA
GS
J
G
G
= 125 °C
= 0 V
b
b
MAX.
D
S
b
S
b
D
1.7
b
62
-
b
MIN.
- 200
- 2.0
2.8
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
S11-0513-Rev. C, 21-Mar-11
www.vishay.com/doc?91000
Document Number: 91084
- 0.24
TYP.
700
200
200
4.5
7.5
1.9
40
12
27
28
24
-
-
-
-
-
-
-
-
-
-
-
-
-
UNIT
°C/W
MAX.
± 100
- 100
- 500
- 4.0
- 6.5
- 6.5
0.80
- 26
300
5.4
2.9
S
29
15
-
-
-
-
-
-
-
-
-
-
-
-
and L
D
UNIT
V/°C
)
nC
nH
μC
nA
μA
pF
ns
ns
Ω
V
V
S
A
V

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