BZT52C24S-TP Micro Commercial Components (MCC), BZT52C24S-TP Datasheet
Home Discrete Semiconductor Products More Semiconductors - Discretes BZT52C24S-TP
Manufacturer Part Number
BZT52C24S-TP
Description
200mW, 24V Zener, SOD-323 / 7" REEL
Manufacturer
Micro Commercial Components (MCC)
Specifications of BZT52C24S-TP
Voltage - Zener (nom) (vz)
24V
Voltage - Forward (vf) (max) @ If
900mV @ 10mA
Current - Reverse Leakage @ Vr
100nA @ 16.8V
Power - Max
200mW
Impedance (max) (zzt)
70 Ohm
Mounting Type
Surface Mount
Package / Case
SOD-323
Operating Temperature
-65°C ~ 175°C
Zener Voltage
24 V
Voltage Tolerance
5 %
Voltage Temperature Coefficient
20.2 mV / C
Power Dissipation
200 mW
Maximum Reverse Leakage Current
0.1 uA
Maximum Zener Impedance
80 Ohms
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Lead Free Status / Rohs Status
Details
Other names
BZT52C24S-TP
Available stocks
Part Number:
BZT52C24S-TP
Revision: A
Micro Commercial Components
Features
•
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25
Absolute Maximum Ratings
Electrical Characteristics
Absolute Maximum Ratings
Symbol
Symbol
Symbol
M C C
R
T
Planar Die Construction
200mW Power Dissipation on Ceramic PCB
General Purpose Medium Current
Ideally Suited for Automated Assembly Processes
designates RoHS Compliant. See ordering information)
V
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Lead Free Finish/RoHS Compliant("P" Suffix
P
T
STG
thJA
F
D
J
Thermal Resistance Junction to
Ambient*
Maximum Forward Voltage
(I
Power dissipation
Junction Temperature
Storage Temperature Range
F
=10mAdc)
mm
2
Parameter
Parameter
Parameter
www.mccsemi.com
TM
omponents
20736 Marilla Street Chatsworth
!"#
$
% !"#
-65 to +150
-65 to +150
Rating
Rating
Rating
625
200
0.9
1 of 3
Unit
Unit
Unit
mW
V
/W
H
C
DIM
A
G
B
C
D
E
H
J
BZT52C2V4S
2.4 to 39 Volts
.090
.063
.045
.031
.010
.004
.004
-----
MIN
BZT52C39S
Zener Diode
INCHES
SUGGESTED SOLDER
G
SOD-323
200 mW
THRU
A
MAX
B
.107
.071
.053
.045
.016
.018
.010
.006
PAD LAYOUT
0.027”
DIMENSIONS
0.074"
2.30
0.25
0.10
-----
1.60
1.15
0.80
0.10
MIN
MM
E
MAX
2.70
1.80
1.35
1.15
0.40
0.45
0.25
0.15
D
2011/01/01
0.022”
NOTE
J
Related parts for BZT52C24S-TP
BZT52C24S-TP Summary of contents
Micro Commercial Components Features Planar Die Construction 200mW Power Dissipation on Ceramic PCB General Purpose Medium Current Ideally Suited for Automated Assembly Processes Epoxy meets UL 94 V-0 flammability rating Moisture Sensitivity Level 1 • Lead Free ...
... BZT52C12S 11.4 12 BZT52C13S 12.4 13 BZT52C15S 13.8 15 BZT52C16S 15.3 16 BZT52C18S 16.8 18 BZT52C20S 18.8 20 BZT52C22S 20.8 22 BZT52C24S 22.8 24 BZT52C27S 25.1 27 BZT52C30S 28 30 BZT52C33S 31 33 BZT52C36S 34 36 BZT52C39S 37 39 (1) Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm (2) f=1KHz www.mccsemi.com Revision: A Maximum Zener ...
BZT52C2V4S-BZT52C39S Typical characteristics 300 200 100 0 100 AMBIENT TEMPERATURE, °C A Fig. 1. Power Derating Curve 25°C C10 j C12 C15 20 C18 C22 10 Test current I Z 5mA ...
... MCC's products are not authorized for use as critical components in life support devices or systems without the express written Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on our web page cited below ...
Related keywords
BZT52C24S-TP datasheet BZT52C24S-TP data sheet BZT52C24S-TP pdf datasheet BZT52C24S-TP component BZT52C24S-TP part BZT52C24S-TP distributor BZT52C24S-TP RoHS BZT52C24S-TP datasheet download
