AFCT-57D5ATPZ Avago Technologies US Inc., AFCT-57D5ATPZ Datasheet - Page 2
AFCT-57D5ATPZ
Manufacturer Part Number
AFCT-57D5ATPZ
Description
SM 8/4/2G SFP, 10Km, RoHS
Manufacturer
Avago Technologies US Inc.
Datasheet
1.AFCT-57D5ATPZ.pdf
(18 pages)
Specifications of AFCT-57D5ATPZ
Data Rate
8.5Gbd
Wavelength
1310nm
Applications
General Purpose
Voltage - Supply
2.97 V ~ 3.63 V
Connector Type
LC Duplex
Mounting Type
SFP
Operating Temperature Classification
Commercial
Package Type
SFP
Mounting
Snap Fit To Panel
Pin Count
20
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Description,
As an enhancement to the conventional SFP interface
defined in SFF-8074i, the AFCT-57D5ATPZ is compliant
to SFF-8472 (digital diagnostic interface for optical trans-
ceivers). Using the 2-wire serial interface defined in the
SFF-8472 MSA, the AFCT-57D5ATPZ provides real time
temperature, supply voltage, laser bias current, laser
average output power and received input power. This in-
formation is in addition to conventional SFP base data. The
digital diagnostic interface also adds the ability to disable
the transmitter (TX_DISABLE), monitor for Transmitter
Faults (TX_FAULT), and monitor for Receiver Loss of Signal
(RX_LOS).
Installation
The AFCT-57D5ATPZ can be installed in any SFF-8074i
compliant Small Form Pluggable (SFP) port regardless of
host equipment operating status. The AFCT-57D5ATPZ is
hot-pluggable, allowing the module to be installed while
the host system is operating and on-line. Upon insertion,
the transceiver housing makes initial contact with the
host board SFP cage, mitigating potential damage due to
Electro-Static Discharge (ESD).
Digital Diagnostic Interface and Serial Identification
The 2-wire serial interface is based on ATMEL AT24C0A
series EEPROM protocol and signaling detail. Conventional
EEPROM memory, bytes 0-255 at memory address 0xA0,
is organized in compliance with SFF-8074i. New digital
diagnostic information, bytes 0-255 at memory address
0xA2, is compliant to SFF-8472. The new diagnostic in-
formation provides the opportunity for Predictive Failure
Identification, Compliance Prediction, Fault Isolation and
Component Monitoring.
Predictive Failure Identification
The AFCT-57D5ATPZ predictive failure feature allows a host
to identify potential link problems before system perfor-
mance is impacted. Prior identification of link problems
enables a host to service an application via “fail over” to
a redundant link or replace a suspect device, maintain-
ing system uptime in the process. For applications where
ultra-high system uptime is required, a digital SFP provides
a means to monitor two real-time laser metrics associated
with observing laser degradation and predicting failure:
average laser bias current (Tx_Bias) and average laser
optical power (Tx_Power).
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continued
Compliance Prediction
Compliance prediction is the ability to determine if an
optical transceiver is operating within its operating and
environmental requirements. AFCT-57D5ATPZ devices
provide real-time access to transceiver internal supply
voltage and temperature, allowing a host to identify
potential component compliance issues. Received optical
power is also available to assess compliance of a cable
plant and remote transmitter. When operating out of
requirements, the link cannot guarantee error free trans-
mission.
Fault Isolation
The fault isolation feature allows a host to quickly pinpoint
the location of a link failure, minimizing downtime. For
optical links, the ability to identify a fault at a local device,
remote device or cable plant is crucial to speeding service
of an installation. AFCT-57D5ATPZ real-time monitors of
Tx_Bias, Tx_Power, Vcc, Temperature and Rx_Power can be
used to assess local transceiver current operating condi-
tions. In addition, status flags Tx_Disable and Rx Loss of
Signal (LOS) are mirrored in memory and available via the
two-wire serial interface.
Component Monitoring
Component evaluation is a more casual use of the AFCT-
57D5ATPZ real-time monitors of Tx_Bias, Tx_Power,
Vcc, Temperature and Rx_Power. Potential uses are as
debugging aids for system installation and design, and
transceiver parametric evaluation for factory or field
qualification. For example, temperature per module can be
observed in high density applications to facilitate thermal
evaluation of blades, PCI cards and systems.