HLMP-LD15-NRTZZ Avago Technologies US Inc., HLMP-LD15-NRTZZ Datasheet - Page 8

• Manufacturer Part Number: HLMP-LD15-NRTZZ
• Description: Lamp,4mm,AlInGaP2,Red,50X100deg
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-LD15-NRTZZ

• Color: Red
• Millicandela Rating: 1290mcd
• Current - Test: 20mA
• Wavelength - Dominant: 630nm
• Wavelength - Peak: 639nm
• Voltage - Forward (vf) Typ: 2.3V
• Lens Type: Diffused, Red Tinted
• Lens Style/size: Oval, 4mm
• Package / Case: Radial - 2 Lead
• Height: 6.30mm
• Viewing Angle: 50°, 100°
• Mounting Type: Through Hole
• Resistance Tolerance: 630nm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
• If lead forming is required before soldering, care must be
• It is recommended that tooling made to precisely form
Soldering Condition:
• Care must be taken during PCB assembly and soldering
• The closest LED is allowed to solder on board is 1.59mm
• Recommended soldering condition:
Recommended Wave Soldering Profile
250
200
150
100
length prior to insertion and soldering into PC board.
taken to avoid any excessive mechanical stress induced
to LED package. Otherwise, cut the leads of LED to length
after soldering process at room temperature. The solder
joint formed will absorb the mechanical stress of the lead
cutting from traveling to the LED chip die attach and
wirebond.
and cut the leads to length rather than rely upon hand
operation.
process to prevent damage to LED component.
below the body (encapsulant epoxy) for those parts
without standoff.
Pre-heat temperature 105 °C Max.
Preheat time
Peak temperature
Dwell time
50
30
0
10
FLUXING
20
PREHEAT
30 sec Max
250 °C Max.
Wave Soldering
3 sec Max.
TURBULENT WAVE
30
40
TIME - SECONDS
Manual Solder
Dipping
−
−
260 °C Max.
5 sec Max
50
60
• Wave soldering parameter must be set and maintain
• If necessary, use fixture to hold the LED component in
• Proper handling is imperative to avoid excessive thermal
• Special attention must be given to board fabrication,
• Recommended PC board plated through holes size for LED
Note: Refer to application note AN1027 for more information on
soldering LED components.
70
according to recommended temperature and dwell time
in the solder wave. Customer is advised to periodically
check on the soldering profile to ensure the soldering
profile used is always conforming to recommended
soldering condition.
proper orientation with respect to the PCB during
soldering process.
stresses to LED components when heated. Therefore, the
soldered PCB must be allowed to cool to room
temperature, 25°C before handling.
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
component leads.
LED component
ead size
0.457 x 0.457mm
(0.018 x 0.018inch)
0.508 x 0.508mm
(0.020 x 0.020inch)
LAMINAR WAVE
80
HOT AIR KNIFE
90
100
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
1.049 to 1.150mm
Plated through
hole diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
(0.041 to 0.045 inch)
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD