HSMZ-A100-T30J1 Avago Technologies US Inc., HSMZ-A100-T30J1 Datasheet - Page 8

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HSMZ-A100-T30J1

Manufacturer Part Number
HSMZ-A100-T30J1
Description
PLCC2,TOP MT,ALINGAP2,RED :
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HSMZ-A100-T30J1

Rohs Compliant
YES
Color
Red
Millicandela Rating
422.5mcd
Current - Test
20mA
Wavelength - Dominant
630nm
Wavelength - Peak
639nm
Voltage - Forward (vf) Typ
2.2V
Lens Type
Clear
Lens Style/size
Round, 2.2mm
Package / Case
2-PLCC
Size / Dimension
3.20mm L x 2.80mm W
Height
1.90mm
Viewing Angle
120°
Mounting Type
Surface Mount
Resistance Tolerance
630nm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Luminous Flux @ Current - Test
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HSMZ-A100-T30J1
Manufacturer:
AVAGO
Quantity:
40 000
Figure 8. Recommended Pb-free reflow soldering profile.
Figure 6. Forward voltage shift vs. temperature.
Note: For detail information on reflow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
Figure 9. Recommended wave soldering profile.
8
-0.1
-0.2
-0.3
250
200
150
100
0.5
0.4
0.3
0.2
0.1
50
30
0
-100
217 C
200 C
150 C
0
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
LEADED SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
GaP/AlGaAs/
AlInGaP
10
-50
FLUXING
20
3 C/SEC. MAX.
PREHEAT
TEMPERATURE – °C
TURBULENT WAVE
3 C/SEC. MAX.
60 - 120 SEC.
255 - 260 C
30
0
InGaN/GaN
TIME – SECONDS
40
50
TIME
50
100
60
70
(Acc. to J-STD-020C)
LAMINAR WAVE
150
HOT AIR KNIFE
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
100 SEC. MAX.
10 to 30 SEC.
80
6 C/SEC. MAX.
90
100
Figure 7. Radiation Pattern.
1.0
0.8
0.6
0.4
0.2
0
-90
-80
-70
Figure 10. Recommended soldering pad pattern.
2.60
-60
-50
-40
ANGULAR DISPLACEMENT – DEGREES
SOLDER RESIST
-30
-20
1.50
-10
0
10
4.50
20 30
40
50
60
70
80
90

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