ICK BGA 27 X 27 X 22 FISCHER ELEKTRONIK, ICK BGA 27 X 27 X 22 Datasheet

ICK BGA 27 X 27 X 22

Manufacturer Part Number

ICK BGA 27 X 27 X 22

Description

HEAT SINK

Manufacturer

FISCHER ELEKTRONIK

Datasheet

1.ICK_BGA_27_X_27_X_22.pdf (1 pages)

Specifications of ICK BGA 27 X 27 X 22

Packages Cooled

BGA

Thermal Resistance

13.5K/W

Width

27mm

Height

22mm

Length

27mm

Mounting Type

Thermally Conductive Adhesive / Foil

Body Plating

Black Anodized

For Use With

Processors

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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Heatsinks for BGAs /

27 x 27 x 22 mm, for IC design BGA and others

Parameters of article ICK BGA 27 x 27 x 22

Accessories/ related articles

Thermally conductive foil both sides adhesive / WLFT 404 27 x 27

Thermally conductive foil both sides adhesive / WLFT 405 27 x 27

dissipation loss [W]

mounting method

socket

suitable for processor type universal

width [mm]

heigth [mm]

plate thickness [mm]

length on stock [mm]

surface treatment

[K/W]

ICK BGA 27 x 27 x 22

13.5

9.5

therm. conductive foil / therm. cond. adhesive

universal

2.5

black anodised

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