ICK S 32 X 32 X 20 FISCHER ELEKTRONIK, ICK S 32 X 32 X 20 Datasheet
ICK S 32 X 32 X 20
Manufacturer Part Number
ICK S 32 X 32 X 20
Description
HEAT SINK
Manufacturer
FISCHER ELEKTRONIK
Datasheet
1.ICK_S_32_X_32_X_20.pdf
(1 pages)
Specifications of ICK S 32 X 32 X 20
Thermal Resistance
3.7K/W
Width
32.7mm
Height
20mm
Length/height, External
20mm
External Width
32mm
Length
32.7mm
External Depth
32mm
Mounting Type
Thermally Conductive Adhesive / Foil
For Use With
Processors
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
H
H
H
H
Pin heatsinks
Thermal conduct. foil WLFT 404/405
Thermal conductive glue
Thermal conductive paste
Processor overview
ICK S 25 x 25 x 12,5
WLF ... 25 x 25
weight: 6 g
ICK S 25 x 25 x 18,5
WLF ... 25 x 25
weight: 7 g
ICK S 29 x 29 x 10
WLF ... 29 x 29
weight: 11 g
ICK S 29 x 29 x 20
WLF ... 29 x 29
weight: 15 g
ICK S 32 x 32 x 10
WLF ... 32 x 32
weight: 14 g
ICK S 32 x 32 x 20
WLF ... 32 x 32
weight: 19 g
art. no.
art. no.
art. no.
art. no.
art. no.
art. no.
E 5
E 14
E 12
B 2 - 7
SMD-heatsinks
Mounting material for semiconduct.
Hole pattern
Technical introduction
Hola1
B 25 – 27
E 34 – 38
A 21
A 2 - 7
B 18
H
H
M
G
N
D
H
A
B
K
C
E
F
L
I
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