ICK S 50 X 50 X 25 FISCHER ELEKTRONIK, ICK S 50 X 50 X 25 Datasheet

HEAT SINK

ICK S 50 X 50 X 25

Manufacturer Part Number
ICK S 50 X 50 X 25
Description
HEAT SINK
Manufacturer
FISCHER ELEKTRONIK
Datasheet

Specifications of ICK S 50 X 50 X 25

Thermal Resistance
2.4K/W
Width
50mm
Height
25mm
Length
50mm
Mounting Type
Thermally Conductive Adhesive / Foil
For Use With
Processors
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Pin heatsinks /
50 x 50 x 25 mm, pin heatsinks quadratic
Parameters of article ICK S 50 x 50 x 25
Accessories/ related articles
Thermally conductive foil both sides adhesive / WLFT 404 50 x 50
Thermally conductive foil both sides adhesive / WLFT 405 50 x 50
Bauform
R
dissipation loss [W]
mounting method
socket
suitable for processor type universal
width [mm]
heigth [mm]
plate thickness [mm]
weight [g]
length on stock [mm]
th
[K/W]
ICK S 50 x 50 x 25
Rechteck
2.4
31.2
therm. conductive foil / therm. cond. adhesive
universal
50
25
3.5
49
50
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