ICK PGA 18X18 FISCHER ELEKTRONIK, ICK PGA 18X18 Datasheet

HEAT SINK, PGA, 8.2°C/W

ICK PGA 18X18

Manufacturer Part Number
ICK PGA 18X18
Description
HEAT SINK, PGA, 8.2°C/W
Manufacturer
FISCHER ELEKTRONIK
Datasheet

Specifications of ICK PGA 18X18

Packages Cooled
PGA
Thermal Resistance
8.2°C/W
External Width
45.7mm
Height
16.51mm
Heat Sink Material
Aluminium
External Depth
45.7mm
External Length / Height
16.51mm
Surface
RoHS Compliant
Surface Finish
Black Anodised
Rohs Compliant
Yes
H
H
H
H
Heatsinks for PGA
Thermal conduct. foil WLFT 404/405
Thermal conductive glue
Thermal conductive paste
Processor overview
ICK PGA 18 x 18
WLF ... 45 x 45
ICK PGA 19 x 19
WLF ... 19 x 19
ICK PGA 19 x 19 x 12
WLF ... 47 x 47
ICK PGA 20 x 20
WLF ... 50 x 50
ICK PGA 20 x 20 K
WLF ... 50 x 50
art. no.
art. no.
art. no.
art. no.
art. no.
with fixing clamp for socket 7 and socket 370
E 5
E 14
E 12
B 2 - 7
SMD-heatsinks
Mounting material for semiconduct.
Hole pattern
Technical introduction
Hola1
B 25 – 27
E 34 – 38
A 21
A 2 - 7
B 10
H
H
M
G
N
D
H
A
B
K
C
E
F
L
I

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