BMP085-0330SBO008 BOSCH, BMP085-0330SBO008 Datasheet - Page 22

• Manufacturer Part Number: BMP085-0330SBO008
• Description: Daughter Board
• Manufacturer: BOSCH

Specifications of BMP085-0330SBO008

• Silicon Manufacturer: Bosch
• Application Sub Type: Accelerometer - Three-Axis
• Kit Application Type: Sensing - Motion / Vibration / Shock
• Silicon Core Number: BMP085
• Kit Contents: Board

BMP085
Bosch Sensortec
Data sheet
5.5 Printed circuit board (PCB) design
Recommended PCB design (top view):
5.6 Moisture sensitivity level and soldering
The BMP085 is classified MSL 1 (moisture sensitivity level) according to IPC/JEDEC standards
J-STD-020C and J-STD-033A.
The device can be soldered Pb-free with a peak temperature of 260°C for 20 to 40 sec. The
minimum height of the solder after reflow shall be at least 50µm. This is required for good
mechanical decoupling between the sensor device and the printed circuit board (PCB).
The BMP085 devices have to be soldered within 6 months after shipment (shelf life). To ensure
good solder-ability, the devices shall be stored at room temperature (20°C).
The soldering process can lead to an offset shift of typically 1hPa.
5.7 RoHS compliancy
The BMP085 sensor meets the requirements of the EC directive "Restriction of hazardous
substances (RoHS)", please refer also to:
"Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment".
The BMP085 sensor is also halogen-free. Please contact your Bosch Sensortec representative
for the corresponding analysis report.
Rev. 1.0
Page 22
01 July 2008
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Specifications are subject to change without notice.