RE130-LF ROTH ELEKTRONIK, RE130-LF Datasheet

RE130-LF

Manufacturer Part Number

RE130-LF

Description

PCB, Pad/Hole

Manufacturer

ROTH ELEKTRONIK

Datasheet

1.RE130-LF.pdf (1 pages)

Specifications of RE130-LF

Board Type

PCB, Pad Per Hole

Board Material

FR-4

External Height

90.17mm

External Width

95.89mm

Board Thickness

1.57mm

Hole Diameter

1mm

Pitch Spacing

2mm

Body Material

Epoxy FR4

Pin Capacity

1848

Pcb Type

Prototyping Board

Rohs Compliant

Yes

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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Prototyping Board Metriclab

RE130-LF

- EPOXY fibre-glass FR 4 1.5 mm single-sided 35 µm CU

- hot air leveling (HAL-leadfree)

- hole spacing 2.00 x 2.00 mm

- 44 x 42 lines of holes

- single-hole conductors 1.60 mm²

- hole dia 1.0 mm

- soldering stop mask at the solder side

- working temperature: max. 150° C

- soldering bath proof: 260° C > 50 sec

- size 90.17 x 95.89 mm

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