AAT10 CIF, AAT10 Datasheet

AAT10

Manufacturer Part Number

AAT10

Description

PCB, ALUMINIUM, 100X150

Manufacturer

CIF

Type

Prototype Boardr

Datasheet

1.AAT10.pdf (2 pages)

Specifications of AAT10

External Height

100mm

External Width

150mm

Board Thickness

1.5mm

Svhc

No SVHC (18-Jun-2010)

Board Material

Aluminium

Copper Thickness

35Âµm

External Length / Height

100mm

Rohs Compliant

Lead Free Status / RoHS Status

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

AAT1011

Quantity:

5 510

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

AAT1011

Manufacturer:

ALLE

Quantity:

5 510

Company:

Meier Automation Equipment Co., Limited

Part Number:

AAT1011

Manufacturer:

TAIWAN

Quantity:

20 000

Company:

Meier Automation Equipment Co., Limited

Part Number:

AAT1013

Manufacturer:

TAIWAN

Quantity:

20 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

AAT1013A

Manufacturer:

MIDCOM

Quantity:

750

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

AAT1014-D

Manufacturer:

SILICON

Quantity:

5 600

Company:

Meier Automation Equipment Co., Limited

Part Number:

AAT1070IDI-T1

Manufacturer:

SKYWORKS/思佳讯

Quantity:

20 000

Current page: 1 of 2
Download datasheet (307Kb)

printed circuit material.

Applications include:

• Smart power packages where power and logic are

A NEW CONCEPT IN

THERMAL MANAGEMENT.

Aluminum Base, Copper Clad Substrate

to manage heat created by power components.

PCB * offers several unique features for design engineers.

Components can be soldered directly to the etched copper

Layer of`

conductive dielectric layer. Also, heat generated by power

components is automatically transferred through this layer to

the base plate of'-

resistance of the circuit board is significantly reduced.

Dielectric

Base plate

PRODUCT DATA.

STANDARD CONFIGURATION

Circuit Layer

P.A

Replacement for heat sinks and other hardware

Replacement for fragile ceramic substrates

Replacement for printed circuit board material

Surface mount -layouts

Custom material combinations and applications requiring

specific thermal, dielectric and physical properties

combined

* P.A PCB

P . A PCB*

PCB*

P C B * is a substrate, a heat sink and a

P . A P

- .062 in. Aluminum (alloy 6061)

- .003 in.

- Copper Foil - .0014 in. printed circuit

and they're isolated by the thermally

is a thermal control substrate designed

Photopositif Aluminium PCB.

C B *_ . As a result, the thermal

PHOTOPOSITIF ALUMINIUM PCB

grade

P . A

REF AAT10 20

(usually copper or aluminum) is bonded with a polymer based,

thermally conductive dielectric to a circuit layer (either copper or

aluminum clad copper foil).

Dielectric Strength

Dielectric Constant

Thermal Conductivity

Surface Resistivity

Process Temperature

Continuous Use

TYPICAL PROPERTIES

THERMAL RESISTANCE

Case #1

Temperature measurement

Operating power

Thermal resistance

Case #2. A surface mount power transistor (MJD 3055) mounted

to an etched pad. 1" x 3" panel size.

Temperature measurement -

Operating power

Thermal resistance

Case #3. A 200

70% of its surface is soldered directly to an etched pad. Junction

temperature was sensed using diodes surrounding the resistor

network. 4" x 5" panel size.

Temperature measurement -

Operating power

Thermal resistance

BASE PLATE MATERIAL: ALUMINUM

P.A

Temperature

POWER

DEVICE ~

PCB* ,s a three layered substrate. The base plate

STANDARD CONSTRUCTION

TO-220 transistor mounted to an etched pad.

4" x 5" panel size.

200 silicon die with a resistor network covering

CIRCUIT LAYER (ETCHED)

4000 Volts min.

5-6

3 Watt Meter

1x10

350°C

180°C

COPPER

junction and panel

junction and pane!

25 watts, DC

1.0°C/watt

( , junction to sink)

25 watts, DC

1.8"C/watt

( , junction to sink)

Megohms

20 watts, DC

1.0°CJwatt

( , junction to sink)

August 2003

–1°

-1

CONDUCTIVE

THERMALLY

DIELECTRIC

LAYER

Related parts for AAT10

AAT10 Summary of contents

Page 1

... Dielectric Base plate - .062 in. Aluminum (alloy 6061) Photopositif Aluminium PCB. * P.A PCB REF AAT10 20 STANDARD CONSTRUCTION P.A PCB three layered substrate. The base plate (usually copper or aluminum) is bonded with a polymer based, thermally conductive dielectric to a circuit layer (either copper or aluminum clad copper foil). ...

Page 2

THERMAL EXPANSION COEFFICIENTS* Epoxy-Glass PCB Material.........................................10-30 Thermal Clad (Aluminum)..............................................25 Thermal Clad (Copper)..................................................18 Thermal Clad (CIC)..........................................................8 Alumina(99.5%)...............................................................7 Beryllia(99.5%)................................................................8 *Approximate values OPERATING TEMPERATURE VS. POWER DISSIPATED tm (Data obtained using DPAK , 3055 Transistors) This table shows how transistors run cooler on ...

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