B32529C332K EPCOS Inc, B32529C332K Datasheet - Page 38

• Manufacturer Part Number: B32529C332K
• Description: CAPACITOR, 3.3NF 63V CAPACITOR, 3.3NF 63V
• Manufacturer: EPCOS Inc
• Series: B32529r

Specifications of B32529C332K

• Capacitance: 0.0033UF
• Voltage Rating, Ac: 40V
• Voltage Rating, Dc: 63V
• Capacitor Dielectric Type: POLYESTER
• Tolerance,: 10%
• Tolerance, -: 10%
• Temp, Op. Max: 100(DEGREE C)
• Rohs Compliant: YES

1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Important notes
at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
B32520 ... B32529
General purpose (stacked/wound)
max
. Long exposure to temperatures above this type-related temperature limit
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