TR-916-SC-S Linx Technologies Inc, TR-916-SC-S Datasheet - Page 17

• Manufacturer Part Number: TR-916-SC-S
• Description: TRANSCEIVER RF 916MHZ 20PIN SMD
• Manufacturer: Linx Technologies Inc
• Series: SCr

Specifications of TR-916-SC-S

• Frequency: 916MHz
• Data Rate - Maximum: 33.6kbps
• Modulation Or Protocol: FM, FSK
• Applications: ISM, Garage Door Opener, Remote Controls, 2-way RKE
• Power - Output: -10dBm
• Sensitivity: -94dBm
• Voltage - Supply: 2.7 V ~ 13 V
• Current - Receiving: 15mA
• Current - Transmitting: 19mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: 0°C ~ 70°C
• Package / Case: Module
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: TR916SCS

TRANSCEIVER AUTOMATED ASSEMBLY
figure 15: Maximum reflow profile
Temperature
Shock During Reflow Transport
Washability
For high-volume assembly most users will want to auto-place the modules. The
modules have been designed to maintain compatibility with most pick-and-place
equipment; however, due to the module's hybrid nature certain aspects of the
automated assembly process are far more critical than for other component types.
Process compatibility is the customer's responsibility. Small trial production runs
should be made to verify yields prior to volume production.
Following are brief discussions of the three primary areas where caution must be
observed.
Reflow Temperature Profile
The single most critical stage in the automated assembly process is the reflow
process. The reflow profile below should be closely followed since excessive
temperatures or transport times during reflow will irreparably damage the
modules. Assembly personnel will need to pay careful attention to the oven's
profile to insure that it meets the requirements necessary to successfully reflow
all components while still meeting the limits mandated by the modules
themselves.
Since some internal module components may reflow along with the components
placed on the board being assembled, it is imperative that the module not be
subjected to shock or vibration during the time solder is liquidus.
The modules are wash resistant, but are not hermetically sealed. They may be
subject to a standard wash cycle; however, a twenty-four-hour drying time should
be allowed before applying electrical power to the modules. This will allow any
moisture that has migrated into the module to evaporate, thus eliminating the
potential for shorting during power-up or testing.
300
250
200
150
100
50
C
0
0
1-1.5 Minutes
30
Ramp-up
125 C
60
Ideal Curve
Limit Curve
90
Preheat Zone
2-2.3 Minutes
120
2 Minutes Max.
Soak Zone
150
Time (Seconds)
220 C
210 C
180 C
Forced Air Reflow Profile
180
Reflow Zone
20-40 Sec.
210
240
270
Cooling
300
330
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