B57301V2472J60 EPCOS Inc, B57301V2472J60 Datasheet - Page 11

• Manufacturer Part Number: B57301V2472J60
• Description: NTC Thermistor 0603 4K7 J60 B-3650
• Manufacturer: EPCOS Inc

Specifications of B57301V2472J60

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Mounting instructions
1
1.1
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommend-
ed as well as a proper cleaning of the PCB.
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metalization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is suitable for all commonly-used soldering methods.
Note: SMD NTCs with AgPd termination are not approved for lead-free soldering.
Figure 1
SMD NTC thermistors, structure of nickel barrier termination
1.1.1
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas 95%.
Solder
SnPb 60/40
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
1.1.2
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges 1/3.
Solder
SnPb 60/40
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
Please read Cautions and warnings and
Important notes at the end of this document.
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
Soldering
SMD NTC thermistors
Solderability (test to IEC 60068-2-58)
Resistance to soldering heat (test to IEC 60068-2-58)
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Bath temperature ( C)
215 3
245 3
Bath temperature ( C)
260 5
260 5
B573**V2/ B57619C5
Dwell time (s)
3 0.3
3 0.3
Dwell time (s)
10 1
10 1