C1206C103J5RAC Kemet, C1206C103J5RAC Datasheet
C1206C103J5RAC
Manufacturer Part Number
C1206C103J5RAC
Description
CAPACITOR CERAMIC, 0.01UF, 50V, X7R, 1206
Manufacturer
Kemet
Datasheet
1.C1206C103J5RAC.pdf
(2 pages)
Specifications of C1206C103J5RAC
Dielectric Characteristic
X7R
Capacitance
0.01µF
Capacitance Tolerance
± 5%
Voltage Rating
50VDC
Capacitor Case Style
1206
No. Of Pins
2
Capacitor Mounting
SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF
C – ±0.25pF
D – ±0.5pF
F – ±1%
G – ±2%
38
KEMET
• C0G (NP0), X7R, Z5U and Y5V Dielectrics
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
* Note: Indicates EIA Preferred Case Sizes
# Note: Different tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette.
SIZE CODE
barrier
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
0402*
0603*
0805*
1206*
1210*
1825*
1812
2220
2225
EIA
SIZE CODE
(Ref only)
METRIC
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
1005
1608
2012
3216
3225
4532
4564
5650
5664
J – ±5%
K – ±10%
M – ±20%
P – (GMV)
Z – +80%, -20%
®
T
1.6 (.063) ± 0.15 (.006)
2.0 (.079) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
3.2 (.126) ± 0.2 (.008)
4.5 (.177) ± 0.3 (.012)
4.5 (.177) ± 0.3 (.012)
5.6 (.220) ± 0.4 (.016)
5.6 (.220) ± 0.4 (.016)
1.0 (.04) ± .05(.002)
DIMENSIONS—MILLIMETERS AND (INCHES)
LENGTH
W
L #
CAPACITOR ORDERING INFORMATION
S
* Part Number Example: C0805C103K5RAC
C 0805 C 103 K 5 R A C*
CAPACITOR OUTLINE DRAWINGS
CERAMIC CHIP/STANDARD
0.8 (.032) ± 0.15 (.006)
1.25 (.049) ± 0.2 (.008)
1.6 (.063) ± 0.2 (.008)
2.5 (.098) ± 0.2 (.008)
3.2 (.126) ± 0.3 (.012)
6.4 (.252) ± 0.4 (.016)
5.0 (.197) ± 0.4 (.016)
6.3 (.248) ± 0.4 (.016)
0.5 (.02) ± .05 (.002)
L
WIDTH
W #
FEATURES
B
THICKNESS MAX.
0.55 (.022)
T (EIA) #
ELECTRODES
0.9 (.035)
1.3 (.051)
1.5 (.059)
1.7 (.067)
1.7 (.067)
1.7 (.067)
1.8 (.071)
2.0 (.079)
• Tape and reel packaging per EIA481-1. (See page
51 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
(14 digits - no spaces)
0.20 (0.008)-0.40 (0.016)
0.35 (.014) ±0.15 (.006)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.6 (.024) ±.35 (.014)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
0.5 (.02) ±.25 (.010)
BANDWIDTH
METALLIZATION
TEMPERATURE CHARACTERISTIC
CONDUCTIVE
B
Change Over Temperature Range
TIN PLATE
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%)
U – Z5U (+22%, -56%)
V – Y5V (+22%, -82%)
Designated by Capacitance
NICKEL PLATE
MIN. SEPARATION
(Standard Chips - For
(Tin-plated nickel barrier)
FAILURE RATE LEVEL
Military see page 45)
VOLTAGE
1 - 100V
2 - 200V
5 - 50V
END METALLIZATION
0.75 (.030)
0.3 (.012)
0.7 (.028)
N/A
N/A
N/A
N/A
N/A
N/A
S
A- Not Applicable
C-Standard
3 - 25V
4 - 16V
8 - 10V
TECHNIQUE
Solder Reflow
Solder Reflow
MOUNTING
Solder Wave
Reflow
Solder
or
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