NTCG104BH103H TDK Corporation, NTCG104BH103H Datasheet - Page 3

• Manufacturer Part Number: NTCG104BH103H
• Description: Thermistors - NTC 0402 10k ohm 3% B (K) 4100 3%
• Manufacturer: TDK Corporation
• Type: NTCr
• Series: NTCGr

Specifications of NTCG104BH103H

• Description Of Terminals: Leadless
• Package / Case: SMD
• Mounting Style: Surface Mount
• Pin Count: 2
• Screening Level: Automotive
• Sensitivity Index: 4100K
• Resistance @ 25c: 10kohm
• Percentage Of Resistance Tolerance @ 25c: ±3
• Accuracy: ±3
• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 125C
• Product Length (mm): 1mm
• Product Height (mm): 0.5mm
• Product Depth (mm): 0.5mm
• Resistance: 10 KOhms
• Tolerance: 3 %
• Termination Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 125 C
• Dimensions: 0.5 mm H
• Lead Free Status / RoHS Status: Compliant

SHAPES AND DIMENSIONS
Type
0603
1005
1608
2012
RECOMMENDED PC BOARD PATTERN
Type
0603
1005
1608
2012
• All specifications are subject to change without notice.
b
a
B
L
L
0.6±0.03
1±0.05
1.6±0.1
2±0.2
a
0.25 to 0.35
0.3 to 0.5
0.6 to 0.8
0.9 to 1.2
b
Electrode material
Internal:Pd
External:Ag/Ni/Sn
W
0.3±0.03
0.5±0.05
0.8±0.1
1.25±0.2
b
0.2 to 0.3
0.35 to 0.45
0.6 to 0.8
0.7 to 0.9
T
0.3±0.03
0.5±0.05
0.8±0.1
0.7±0.2
c
0.25 to 0.35
0.4 to 0.6
0.6 to 0.8
0.9 to 1.2
Dimensions in mm
Dimensions in mm
B
0.1 min.
0.1 min.
0.2 min.
0.2 min.
STRUCTURAL DIAGRAM
RECOMMENDED REFLOW SOLDERING CONDITIONS
Ag termination
260˚C max.
250˚C
220˚C
180˚C
150˚C
underlayer
Sn plating
Ni plating
Inner electrode
Preheating
( Palladium )
60 to 120s
Time(s)
( Metal oxide sintering ceramics )
Thermistor body
Soldering
60s max.
10s max.
010-01 / 20090528 / eb221_ntcg.fm
Natural
cooling
(2/13)