NCP15XM472K03RC Murata, NCP15XM472K03RC Datasheet - Page 20

• Manufacturer Part Number: NCP15XM472K03RC
• Description: Thermistors - NTC 4.7K OHM 10%
• Manufacturer: Murata
• Type: NTCr
• Series: NCPr

Specifications of NCP15XM472K03RC

• Description Of Terminals: Leadless
• Package / Case: SMD
• Mounting Style: Surface Mount
• Pin Count: 2
• Screening Level: Automotive
• Sensitivity Index: 3500K
• Resistance @ 25c: 4.7kohm
• Percentage Of Resistance Tolerance @ 25c: ±10
• Accuracy: ±2
• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 125C
• Product Length (mm): 1mm
• Product Height (mm): 0.5mm
• Product Depth (mm): 0.5mm
• Resistance: 4.7 KOhms
• Tolerance: 10 %
• Operating Temperature Range: - 40 C to + 125 C
• Current Rating: 0.46 mAmp
• Power Rating: 100 mW
• Lead Free Status / RoHS Status: Compliant

!Note
!Note
4. Solder and Flux
(1) Solder and Paste
(a) Reflow Soldering : NCP03/15/18/21 Series
5. Cleaning Conditions
For removing the flux after soldering, observe the following
points in order to avoid deterioration of the characteristics or
any change of the external electrodes' quality.
6. Drying
After cleaning, promptly dry this product.
7. Printing Conditions of Solder Paste
8. Adhesive Application and Curing
NCP03
NCP15
NCP18/NCP21
The amount of solder is critical. Standard height of fillet is
shown in the table below.
Too much soldering may cause mechanical stress,
resulting in cracking, mechanical and/or electronic
damage.
Thin or insufficient adhesive may result in loose
component contact with land during flow soldering.
Low viscosity adhesive causes chips to slip after
mounting.
Use RA/RMA type or equivalent type of solder paste. For
your reference, we are using the solder paste below for
any internal tests of this product.
•RMA9086 90-4-M20 (Sn:Pb=63wt%:37wt%)
(Manufactured by Alpha Metals Japan Ltd.)
•M705-221BM5-42-11 (Sn:Ag:Cu=96.5wt%:3.0wt%:0.5wt%)
(Manufactured by Senju Metal Industry Co., Ltd.)
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
Part Number
The solder paste thickness
100 m
100 m
150 m
(b) Flow Soldering : NCP18/21 Series
(2) Flux
Solvent
Dipping Cleaning
Ultrasonic Cleaning
Reference: Optimum Solder Amount
We are using the solder paste below. For any internal
tests of this product.
•Sn : Pb=63wt%:37wt%
•Sn : Ag : Cu=96.5wt% : 3.0wt% : 0.5wt%
Use Rosin-based flux.
Do not use strong acidic flux (with halide content
exceeding 0.2wt%)
E
Chip Type !Caution/Notice
Isopropyl Alcohol
Less than 5min. at room
temp. or less than 2min.
at 40 C max.
Less than 5min. 20W/r
Frequency of 28 to
40kHz.
Electrode
Solder
NCP03/15
0.2mmVTVE
1/3EVTVE
1/3EVTVE
T
Isopropyl Alcohol
Less than 5min. at room
temp. or less than 2min.
at 40 C max.
Less than 1min. 20W/r
Frequency of several
10kHz to 100kHz.
R44E9.pdf 05.4.13
T
NCP18/21
Solder
19
2
4