EH2600ETTS-52.4288M TR Ecliptek, EH2600ETTS-52.4288M TR Datasheet - Page 6

• Manufacturer Part Number: EH2600ETTS-52.4288M TR
• Manufacturer: Ecliptek

Specifications of EH2600ETTS-52.4288M TR

• Lead Free Status / RoHS Status: Compliant

Recommended Solder Reflow Methods
Low Temperature Infrared/Convection 240°C
T
Preheat
- Temperature Minimum (T
- Temperature Typical (T
- Temperature Maximum (T
- Time (t
Ramp-up Rate (T
Time Maintained Above:
- Temperature (T
- Time (t
Peak Temperature (T
Target Peak Temperature (T
Time within 5°C of actual peak (t
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
S
EH2600ETTS-52.4288M TR
MAX to T
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 12/9/2010 | Page 6 of 6
S
L
)
MIN)
L
(Ramp-up Rate)
L
L
)
T Max
to T
T Min
S
S
P
)
P
)
T
T
P
L
S
TYP)
S
S
MIN)
P
MAX)
Target)
p
)
t Preheat
S
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Temperatures shown are applied to body of device.
t 25°C to Peak
Ramp-up
Time (t)
t
P
t
L
Critical Zone
T to T
L
Ramp-down
P