CRCW04020000ZSTD Vishay, CRCW04020000ZSTD Datasheet - Page 6

RESISTOR, CHIP, JUMPER, ZERO OHM, 63mW

CRCW04020000ZSTD

Manufacturer Part Number
CRCW04020000ZSTD
Description
RESISTOR, CHIP, JUMPER, ZERO OHM, 63mW
Manufacturer
Vishay
Type
Thick Filmr
Series
CRCWr

Specifications of CRCW04020000ZSTD

Resistance
0Ohm
Temperature Coefficient
Not Required
Power Rating(s)
Not RequiredW
Tolerance (+ Or -)
Not Required
Mounting Style
Surface Mount
Package / Case
0402
Operating Temp Range
-55C to 155C
Case Style
Molded
Military Standard
Not Required
Failure Rate
Not Required
Product Length (mm)
1mm
Product Depth (mm)
0.5mm
Product Height (mm)
0.35mm
Power Rating
63mW
Voltage Rating
50V
Resistor Element Material
Thick Film
Resistor Case Style
0402
No. Of Pins
2
Construction
Rectangular
Lead Free Status / RoHS Status
Not Compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant, Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CRCW04020000ZSTD
Quantity:
5 000
Part Number:
CRCW04020000ZSTDHP
Manufacturer:
FREESCALE
Quantity:
301
D/CRCW e3
Vishay
www.vishay.com
130
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
4.5
4.7
4.13
4.17.2
4.8.4.2
4.32
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
METHOD
60068-2
21 (Uu
21 (Uu
14 (Na)
30 (Db)
30 (Db)
58 (Td)
13 (M)
2 (Ba)
1 (Aa)
TEST
IEC
-
-
-
-
-
-
-
3
1
)
)
Short time overload
Substrate bending
Climatic sequence:
Rapid change of
Damp heat, cyclic
Damp heat, cyclic
Low air pressure
Voltage proof
Temperature
Solderability
temperature
Resistance
Endurance
(adhesion)
coefficient
DC load
at 70 °C
Dry heat
Shear
TEST
Cold
For technical questions, contact:
Standard Thick Film Chip Resistors
Stability for product types:
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
This datasheet is subject to change without notice.
1 kPa; (25 ± 10) °C; 1 h
U =
duration: Acc. to style
Solder bath method;
Solder bath method;
U = 2.5 x
(20/- 55/20) C and
U = 1.4 x U
non activated flux;
non-activated flux;
30 min. at - 55 °C;
55 °C;  90 % RH;
55 °C;  90 % RH;
1.5 h on; 0.5 h off;
30 min. at 125 °C
Sn96.5Ag3Cu0.5
(20/125/20) C
PROCEDURE
U =
24 h; 5 cycles
70 °C; 1000 h
70 °C; 8000 h
Depth 2 mm;
125 °C; 16 h
24 h; 1 cycle
(235 ± 5) °C
(245 ± 5) C
1000 cycles
 2 x U
- 55 °C; 2 h
P
Sn60Pb40
(2 ± 0.2) s
(3 ± 0.3) s
5 cycles
70
3 times
P
x R
D/CRCW e3
-
-
70
P
max.
ins
70
x R
 U
; 60 s
;
x R
max.
;
thickfilmchip@vishay.com
±0.25 % R + 0.05)
± (0.25 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (2 % R + 0.1 )
No visible damage, no open circuit in bent position
OR BETTER
± 100 ppm/K
STABILITY
CLASS 1
± 1 %
PERMISSIBLE CHANGE (R)
Good tinning ( 95 % covered)
Good tinning ( 95 % covered)
No flashover or breakdown
± (0.25 % R + 0.05 )
SIZE 0402 to 2512
No visible damage
REQUIREMENTS
no visible damage
no visible damage
1  to 10 M
± (0.5 % R + 0.05 )
±0.5 % R + 0.05)
Document Number: 20035
www.vishay.com/doc?91000
± (1 % R + 0.05 )
± (2 % R + 0.1 )
± (2 % R + 0.1 )
± (4 % R + 0.1 )
OR BETTER
± 200 ppm/K
STABILITY
CLASS 2
Revision: 08-Mar-11
± 5 %

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