8444-11B1-RK-TP 3M Interconnect Solutions, 8444-11B1-RK-TP Datasheet

8444-11B1-RK-TP

Manufacturer Part Number

8444-11B1-RK-TP

Description

Manufacturer

3M Interconnect Solutions

Type

PLCC Socketr

Datasheet

1.8444-11B1-RK-TP.pdf (3 pages)

Specifications of 8444-11B1-RK-TP

Number Of Contacts

44POS

Number Of Contact Rows

Pitch (mm)

2.54mm

Grid Size

Not Required

Contact Plating

Tin Over Nickel

Insulation Material

Polyester

Mounting Style

Through Hole

Contact Material

Copper Alloy

Operating Temp Range

-40C to 105C

Product Height (mm)

8mm

Product Depth (mm)

23.5mm

Product Length (mm)

23.5mm

Gender

SKT

Body Orientation

Straight

Contact Resistance Max

15mOhm

Lead Free Status / RoHS Status

Compliant

Current page: 1 of 3
Download datasheet (138Kb)

Low Profile, Four-Row, Through-Hole

Physical

Electrical

Environmental

Interconnect Solutions

http://www.3M.com/interconnects/

™

hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers; or (b) 0.01% (by weight) for cadmium. Unless otherwise stated in

*"RoHS compliant" means that the product or part does not contain any of the following substances in excess of the following maximum concentration

values in any homogeneous material, unless the substance is in an application that is exempt under RoHS: (a) 0.1% (by weight) for lead, mercury,

Chip Carrier Sockets

Flammability: UL 94V-0

Underplating: 50 μ″, [ 1.27 μm ] Nickel - Overall

Wiping Area: 160 μ″, [ 4.06 μm ] Matte Tin

Insulation Resistance:

Temperature Rating:

Contact Resistance:

Insulation

Material: Glass Filled Polyester (PBT)

Material: Copper Alloy

Contact

writing by 3M, this information represents 3M's knowledge and belief based on information provided by third party suppliers to 3M.

Plating

Color: Black

Capacitance: <1 pF at 1MHz

15 mΩ

>10

-40°C to +105°C

MΩ minimum

• Wave solder compatible. Not suitable for

• RoHS* compliant

• Accepts chip carriers conforming to JEDEC

• Compatible with automated loading

• Open top design allows unrestricted air flow

• Molded slots for ease of device extraction

Date Modified: December 12, 2006

outline MO-047 for square and MO-052 for

rectangular

equipment

reflow soldering

For technical, sales or ordering information call

3M is a trademark of 3M Company.

8400 Series

800-225-5373

TS-2148-03

Sheet 1 of 2

Related parts for 8444-11B1-RK-TP

8444-11B1-RK-TP Summary of contents

Page 1

Chip Carrier Sockets ™ Low Profile, Four-Row, Through-Hole Physical Insulation Material: Glass Filled Polyester (PBT) Flammability: UL 94V-0 Color: Black Contact Material: Copper Alloy Plating Underplating: 50 μ″, [ 1.27 μm ] Nickel - Overall Wiping Area: 160 μ″, ...

Page 2

... Chip Carrier Sockets ™ Low Profile, Four-Row, Through-Hole Contact Part No. Quantity 20 8420-11B1-RK-TP 28 8428-11B1-RK-TP 32 8432-11B1-RK-TP 44 8444-11B1-RK-TP 52 8452-11B1-RK-TP 68 8468-11B1-RK-TP 84 8484-11B1-RK-TP 20 POSITION POSITION Ordering Information 84XX - 11B1 - Note: Parts packaged in tubes. 3 Interconnect Solutions http://www.3M.com/interconnects 15.50 [0.611] 15.50 [0.611] 18.05 [0.711] 18.05 [0.711] 18.05 [0.711] 20 ...

Page 3

Important Notice All statements, technical information, and recommendations related to 3M’s products are based on information believed to be reliable, but the accuracy or completeness is not guaranteed. Before using this product, you must evaluate it and determine if it ...

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