2-1571552-6 TE Connectivity, 2-1571552-6 Datasheet

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2-1571552-6

Manufacturer Part Number
2-1571552-6
Description
820-AG11D-ESL-LF=800 DIP,GF/SN
Manufacturer
TE Connectivity
Type
DIP Socketr
Datasheet

Specifications of 2-1571552-6

Number Of Contacts
20POS
Number Of Contact Rows
2
Row Spacing (mm)
7.62mm
Pitch (mm)
2.54mm
Grid Size
Not Required
Contact Plating
Gold Over Nickel
Insulation Material
Polychlorinated Terp
Mounting Style
Through Hole
Contact Material
Beryllium Copper
Operating Temp Range
-55C to 125C
Product Height (mm)
4.57mm
Product Depth (mm)
10.16mm
Product Length (mm)
25.4mm
Gender
SKT
Body Orientation
Straight
Insertion Force
179
Current Rating
3/ContactA
Insulation Resistance
5Gohm
Contact Resistance Max
10mOhm
Rohs Compliant
YES
Lead Free Status / RoHS Status
Compliant
820 - AG11D - ESL- LF Product Details
820 - AG11D - ESL - LF
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Documentation & Additional Information
Product Drawings:
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CAD Files: (
Product Features
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Termination Related Features:
Body Related Features:
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OPEN FRAME DIP. ECONOMY (STAMPED CONTACT) (REF AUGA...
(PDF, English)
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2D Drawing
3D Model
3D Model
Product Type
Number of Positions
Profile = Standard
Frame Style
Leg Style
Sleeve Material = Brass
Product Series = 800 Series
Insulation Resistance (M?) = 5,000
Contact Resistance (m?) = 10
Termination (Solder) Post Length (mm [in])
3.18 [0.125]
Solder Tail Contact Plating = Tin
Row - to - Row Spacing (mm [in])
Mount Style
Centerline (mm [in])
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CAD Format & Compression Information
>
By Type
(IGES, Version E2)
(STEP, Version E2)
= Straight
(DXF, Version E2)
= Ladder
= Vertical
= DIP Socket
(Please use the Product Drawing for all design activity)
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Socket/Card Products
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DIP Sockets
= 20
Resources
= 2.54 [0.100]
Product Highlights:
Products
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Always EU RoHS/ELV Compliant
DIP Socket
Number of Positions = 20
Row - to - Row Spacing = 7.62 mm
Thru Hole
Mount Style = Vertical
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2008 Tyco Electronics Corporation All Rights Reserved
= 7.62 [0.300]
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Contact Related Features:
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> Product Details
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Statement of Compliance
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Contact Mount
Contact Material
Contact Mating Area Plating Material
Contact Style
Mating Contact Type
Height Above PC Board (mm [in])
[0.105]
RoHS/ELV Compliance
compliant
Lead Free Solder Processes
capable to 240°C, Wave solder capable to 260°
C, Wave solder capable to 265°C
RoHS/ELV Compliance History = Always was
RoHS compliant
Temperature Range (°C) = 125
Packaging Method
Brand = AMP
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Additional Information:
Related Products:
= Stamped + Formed
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= Thru Hole
Product Line Information
Tooling
= Beryllium Copper
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= Tube
)
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= Four - Fingered
= RoHS compliant, ELV
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This Product
= Wave solder
= 2.67
= Gold (5)
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